| Phone No. | +886-3-5715131 #33843 (Lab:33860) |
| Office | Delta Building R417, NTHU |
| cnliao@mx.nthu.edu.tw | |
| Education | Ph.D, Materials Science and Engineering, University of California, Los Angeles, USA |
| Personal Website | https://teemtw.wixsite.com/cnliao |
| Lab | 33860 |
| Discipline | Kinetic Process of Materials, Introduction to Material Science and Engineering, Introduction to Quantum Physics, Thermoelectric materials, Nano/micro Electromechanical Systems (N/MEMS), Introduction to Crystal Structure and Diffraction Theories |
| Speciality |
Thermoelectric Materials and Device; Optoelectronic and Electrochemistry Catalyst; Manufacture and Analysis for Electrode Materials; Synthesis and Analysis Copper Twin Crystal Nano-wire; Electromigration in Integrated Circuit Connecting Wire
|
Chien-Neng Liao
NTHU Distinguished Professor
Work Experience
| Institution | Title | Date |
|---|---|---|
| Interdisciplinary Program of Engineering (IPE), National Tsing Hua University | Vice Chair | 2019-09 ~ |
| Department of Materials Science and Engineering, National Tsing Hua University | Professor | 2010-08 ~ |
| IEEE International Interconnect Technology Conference (IITC) | Committee member | 2009-09 ~ 2017-08 |
| Department of Materials Science and Engineering, National Tsing Hua University | Vice Chairman | 2009-09 ~ 2012-08 |
| Department of Materials Science and Engineering, National Tsing Hua University | Associate Professor | 2006-08 ~ 2010-07 |
| Department of Materials Science and Engineering, National Tsing Hua University | Assistant Professor | 2001-08 ~ 2006-07 |
| Intel Corporation | Senior Research Engineer | 1999-08 ~ 2001-07 |
Inside School HonorOverview
| 得獎年度 | 獎項名稱 | 頒獎單位 |
|---|---|---|
| 2017 | Outstanding Teaching Award | National Tsing Hua University |
| 2014 | Outstanding Teaching Award | National Tsing Hua University |
| 2014 | Outstanding Teaching Award | College of Engineering, National Tsing Hua University |
| 2006 | Outstanding Teaching Award | College of Engineering, National Tsing Hua University |
| 2006 | New Faculty Research Award | College of Engineering, National Tsing Hua University |
Outside School HonorOverview
| 得獎年度 | 獎項名稱 | 頒獎單位 |
|---|---|---|
| 2009 | Ta-You Wu Memorial Research Award 2009 | National Science Council |
| 2009 | Award for Junior Research Investigators 2009 | Academia Sinica |
| 2009 | Nano Science & Technology of Y. Z. Hsu Scientific Paper Award | Far Eastern Y. Z. Hsu Science and Technology Memorial Foundation |
Research ProjectOverview
| Year | Project Name | Participator | Job | Period | Cooperative Organization |
|---|---|---|---|---|---|
| 2019 | Development of thick-film printing technology for low-power thermoelectric generators | Chien-Neng Liao | PI | 2019-08 ~ 2022-07 | Ministry of Science and Technology |
| 2019 | 微型散熱裝置內部毛細結構製作與特性研究 | Chien-Neng Liao | PI | 2019-05 ~ 2020-04 | Advanced Semiconductor Engineering, Inc. |
| 2018 | Investigation of nanotwinned Cu/oxide core-shell nanoarrays in bio-sensing and hydrogen energy applications | Chien-Neng Liao | PI | 2018-08 ~ 2019-07 | Ministry of Science and Technology |
| 2018 | Electromigration-induced nanoprecipitation in thermoelectric materials: Processing, Characterization and Modeling | Chien-Neng Liao | PI | 2018-04 ~ 2020-03 | Ministry of Science and Technology |
| 2017 | 印刷熱電源元件堆疊與電流燒結機制探討 | Chien-Neng Liao | PI | 2017-04 ~ 2017-11 | Industrial Technology Research Institute |
| 2017 | A study of nanotwinned Cu nanoarray structures: Oxide formation kinetics and photoelectrochemical characterization | Chien-Neng Liao | PI | 2016-08 ~ 2018-07 | Ministry of Science and Technology |
| 2016 | 105年度大專學生研究計畫-碲化鉍系熱電厚膜製程及特性分析 | Chien-Neng Liao | PI | 2016-07 ~ 2017-02 | Ministry of Science and Technology |
| 2016 | A study of nanotwinned Cu nanoarray structures: Oxide formation kinetics and photoelectrochemical characterization1/2 | Chien-Neng Liao | PI | 2016-08 ~ 2018-07 | Ministry of Science and Technology |
| 2016 | 學界分包-印刷熱電材料燒結機制及特性分析 | Chien-Neng Liao | PI | 2016-04 ~ 2015-11 | Industrial Technology Research Institute |
| 2015 | Fabrication and characterization of nanotwinned Cu-based alloy nanowires(3/3) | Chien-Neng Liao | PI | 2015-08 ~ 2016-07 | Ministry of Science and Technology |
| 2015 | Electromigration in V-VI compound semiconductors: transport mechanism and applications in thermoelectrics(1/3) | Chien-Neng Liao | PI | 2015-08 ~ 2016-07 | Ministry of Science and Technology |
| 2015 | 委託Bi2Te3印刷熱電材料電流輔助退火製程 | Chien-Neng Liao | PI | 2015-07 ~ 2015-12 | Industrial Technology Research Institute |
| 2014 | Fabrication and characterization of nanotwinned Cu-based alloy nanowires(2/3) | Chien-Neng Liao | PI | 2014-08 ~ 2015-07 | Ministry of Science and Technology |
| 2014 | 具奈米雙晶結構銅奈米線之可靠度研究 | Chien-Neng Liao | PI | 2014-04 ~ 2015-03 | TSMC |
| 2014 | Bi2Te3系統熱電材料電流輔助熱退火燒結 | Chien-Neng Liao | PI | 2014-06 ~ 2014-12 | Industrial Technology Research Institute |
| 2014 | 高熱電功率熱電薄膜材料開發研究 | Chien-Neng Liao | PI | 2014-08 ~ 2015-07 | Ministry of Science and Technology |
| 2014 | 103年度大專學生研究計畫 | Chien-Neng Liao | PI | 2014-07 ~ 2015-02 | Ministry of Science and Technology |
| 2013 | Transport mechanism of doping-induced homojuncion structured thermoelectric materials(2/2) | Chien-Neng Liao | PI | 2013-08 ~ 2014-07 | National Science Council |
| 2013 | 碲化鉍系熱電材料改質開發研究 | Chien-Neng Liao | PI | 2013-02 ~ 2014-11 | China Steel Corporation |
| 2013 | Fabrication and characterization of nanotwinned Cu-based alloy nanowires(1/3) | Chien-Neng Liao | PI | 2013-08 ~ 2014-07 | National Science Council |
| 2013 | 熱電模組結合界面原子擴散機制探討 | Chien-Neng Liao | PI | 2013-04 ~ 2013-11 | Industrial Technology Research Institute |
| 2013 | 熱電轉換材料應用與評估 | Chien-Neng Liao | PI | 2013-03 ~ 2013-11 | Taiwan Textile Research Institute |
| 2012 | Transport mechanism of doping-induced homojuncion structured thermoelectric materials | Chien-Neng Liao | PI | 2012-08 ~ 2013-07 | National Science Council |
| 2012 | Structure stability of nanotwinned Cu wires under electrical and thermal stressing(3/3) | Chien-Neng Liao | PI | 2012-08 ~ 2013-07 | National Science Council |
| 2012 | 電流退火操控熱電材料微結構與析出相之研究 | Chien-Neng Liao | PI | 2012-04 ~ 2012-11 | Industrial Technology Research Institute |
| 2012 | 碲化鉍系熱電材料改質開發研究 | Chien-Neng Liao | PI | 2012-08 ~ 2013-07 | China Steel Corporation |
| 2009 | 高頻電力與信號傳輸元件之薄膜化與材料技術三年計畫(第2年) | Chien-Neng Liao | PI | 2009-07 ~ 2010-06 | 經濟部學界科專 |
| 2009 | Fabrication and characterization of high-power thin film thermoelectric coolers(3/3) | Chien-Neng Liao | PI | 2009-08 ~ 2010-07 | National Science Council |
| 2009 | Low-temperature waste heat harvesting system by thermoelectric generation technology | Chien-Neng Liao | PI | 2009-11 ~ 2010-12 | National Science Council |
| 2009 | 電池管理模組散熱用奈米薄膜型熱電元件開發 | Chien-Neng Liao | PI | 2009-02 ~ 2009-11 | Industrial Technology Research Institute |
| 2009 | 電流效應對鉍-硒-碲奈米晶薄膜熱電性質影響之研究 | Chien-Neng Liao | PI | 2009-04 ~ 2009-11 | Industrial Technology Research Institute |
| 2009 | 奈米電子元件雙晶結構銅導線之電遷移動力機制研究 | Chien-Neng Liao | PI | 2009-03 ~ 2009-12 | Ministry of Education |
| 2008 | 高頻電力與信號傳輸元件之薄膜化與材料技術三年計畫(第1年) | Chien-Neng Liao | PI | 2008-07 ~ 2009-06 | 經濟部學界科專 |
| 2008 | 電流效應對碲化鉍熱電薄膜微結構與性質影響 | Chien-Neng Liao | PI | 2008-05 ~ 2008-11 | Industrial Technology Research Institute |
| 2008 | Fabrication and characterization of high-power thin film thermoelectric coolers(2/3) | Chien-Neng Liao | PI | 2008-08 ~ 2009-07 | National Science Council |
| 2008 | Development of nanoscale thin film thermoelectric devices | Chien-Neng Liao | PI | 2008-01 ~ 2008-12 | National Science Council |
| 2007 | 奈米晶尺寸效應對碲化鉍系列材料熱電性質影響之研究 | Chien-Neng Liao | PI | 2007-05 ~ 2007-11 | Industrial Technology Research Institute |
| 2007 | 熱電薄膜沉積製程與特性量測研究 | Chien-Neng Liao | PI | 2007-04 ~ 2007-11 | Industrial Technology Research Institute |
| 2007 | Fabrication and characterization of high-power thin film thermoelectric coolers(1/3) | Chien-Neng Liao | PI | 2007-08 ~ 2008-07 | National Science Council |
| 2006 | 高頻通訊元件及高材料技術計畫第四年 | Chien-Neng Liao | PI | 2006-06 ~ 2007-05 | Ministry of Economic Affairs |
| 2006 | 薄膜材料熱傳導量測研究與系統設計 | Chien-Neng Liao | PI | 2006-04 ~ 2006-11 | Industrial Technology Research Institute |
| 2006 | 提升產業技術及培育研究計畫--熱電材料性質量測技術開發研究 | Chien-Neng Liao | PI | 2006-05 ~ 2007-04 | 致惠科技 |
| 2006 | Effects of interfacial reactions on sold joint characteristics and performance of thermoelectric modules | Chien-Neng Liao | PI | 2006-08 ~ 2007-07 | National Science Council |
| 2006 | Development of thermoelectric materials characterization techniques | Chien-Neng Liao | PI | 2006-05 ~ 2007-04 | National Science Council |
| 2005 | A study of reaction kinetics and thermoelectric poperties of Bi/Te composite thin films | Chien-Neng Liao | PI | 2005-08 ~ 2006-07 | National Science Council |
| 2005 | 熱電致冷器之製作相關技術與相關機台建立服務 | Chien-Neng Liao | PI | 2005-04 ~ 2006-03 | 致惠科技 |
| 2004 | A study of thermoelectric properties of multi-element high entropy alloy | Chien-Neng Liao | PI | 2004-08 ~ 2005-07 | National Science Council |
| 2004 | Effect of intermetallic compound formation on electrical and thermal characteristics of solder joints | Chien-Neng Liao | PI | 2004-08 ~ 2005-07 | National Science Council |
| 2004 | 無塵室高溫製程設備操作模式探討 | Chien-Neng Liao | PI | 2004-03 ~ 2004-11 | Industrial Technology Research Institute |
Journal Articles
| Year | Author | Title |
|---|---|---|
| Accepted | P.-C. Wei, C. N. Liao, H.-J. Wu, D. Yang, J. He, G. V. Biesold-McGee, S. Liang, W.-T. Yen, X. Tang, J.-W. Yeh, Z. Lin, and J. H. He | “Thermodynamic routes to ultra-low thermal conductivity and high thermoelectric performance”, Adv. Mater. |
| 2020 | C.-Y. Lan, C.-Y. Hsu, Y.-C. Lee, C. N. Liao* | “Grain growth behavior and enhanced thermoelectric properties ofPbTe consolidated by high-density pulse current”, J. Alloys Comp., 815, 1526582. |
| 2019 | H.-H. Fan, W.-L. Weng, C.-Y. Lee, C. N. Liao* | “Electrochemical Cycling-Induced Spiky CuxO/Cu Nanowire Array for Glucose Sensing”, ACS Omega, 4, 12222 – 12229. |
| 2019 | C.-L. Huang, W.-L. Weng, Y.-S. Huang C. N. Liao* | ”Enhanced photolysis stability of Cu2O grown on Cu nanowires with nanoscale twin boundaries”, Nanoscale, 11, 13709 - 13713. DOI: 10.1039/c9nr01406c. (Outside Back Cover). |
| 2018 | W.-L. Weng, C.-Y. Hsu, J.-S. Lee, H.-H. Fan, C. N. Liao* | “Twin-mediated epitaxial growth of highly lattice-mismatched Cu/Ag core–shell nanowires”, Nanoscale, 10, 9862-9866. |
| 2018 | Chun-Lung Huang, Wei-Lun Weng, Chien-Neng Liao*, K. N. Tu | Nature Communications:Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface |
| 2018 | J.-C. Hsiao, Y.-H. Chen, C. N. Liao* | “Anisotropic thermal conductivity of sputtered Bi0.5Sb1.5Te3 films after current-assisted thermal treatment”, Thin Solid Films, 645, 93-96. |
| 2018 | C.-T. Li, Y.-H. Chen, C. N. Liao* | “Electrically motivated atomic migration and defect formation in Bi0.5Sb1.5Te3 compounds”, Mater. Chem. Phys., 204, 373-377. (SCI) |
| 2018 | C.-L. Huang, W.-L. Weng, C. N. Liao*, K. N. Tu | “Suppression of interdiffusion- induced voiding in oxidation of copper nanowires with twin-modified surface”, Nat. Commun. 9, 340. |
| 2017 | Y.-H. Chen and C. N. Liao* | “Transport properties of electrically sintered bismuth antimony telluride with antimony nanoprecipitation”, Appl. Phys. Lett., 111, 143901. |
| 2017 | Y.-H. Chen and C. N. Liao* | “Scattering characteristics of grain boundaries in electrically sintered Bi0.4Sb1.6Te3 compounds”, Mater. Lett., 197, 21-23. |
| 2017 | J.-S. Lee, W.-L. Weng, C. N. Liao* | “Characterization and modeling of twinning superlattice structure in copper nanowires”, Mater. Lett., 194, 23-25. |
| 2017 | T. T. Shen, C. N. Liao* | “Enhancement of fatigue resistance of Bi-Sb-Te films on flexible substrates by current-assisted thermal annealing”, Mater. Lett., 186, 314-317. |
| 2016 | H.-H. Huang, M.-P. Lu and C. N. Liao* | “Transverse thermoelectric effect of asymmetrically doped Bi-Sb-Te compounds”, J. Appl. Phys., 119, 205101. |
| 2016 | Y.-T. Huang, C.-W. Huang, J.-Y. Chen, Y.-H. Ting, S.-L. Cheng, C.-N. Liao and W.-W. Wu | “Mass transport phenomena in copper nanowires at high current density”, Nano Research, 9, 1071. |
| 2016 | H.-P. Chen, C.-W. Huang, C.-W. Wang, W.-W. Wu, C.-N. Liao, L.-J. Chen and K.-N. Tu, | “Optimization of the nanotwin-induced zigzag surface of copper by electromigration”, Nanoscale, 8, 2584. |
| 2015 | M.-P. Lu, C. N. Liao*, J.-Y. Huang, H.-C. Hsu | “Thermoelectric Properties of Ag-Doped Bi2(Se,Te)3 Compounds: Dual Electronic Nature of Ag-Related Lattice Defects”, Inorg. Chem., 54, 7438. |
| 2015 | C.-L. Huang and C. N. Liao* | “Chemical reactivity of twin-modified copper nanowire surfaces”, Appl. Phys. Lett., 107, 021601. |
| 2015 | C.-J. Yang, C.-L. Huang and C. N. Liao* | “Enhancing chemical stability of electroplated Cu films by engineering electrolyte chemistry and twinning structure”, J. Electron. Mat. 44, 2529. |
| 2014 | P. H. Le*, C. N. Liao, C. W. Luo, J. Leu! | Thermoelectric properties of nanostructured bismuth-telluride thin films grown using pulsed laser deposition, J. Alloys Comp. 615, 546–552, |
| 2014 | Y. L. Liu* and C. N. Liao! | Experimental and theoretical assessments of thermal boundary resistance between Bi0.4Sb1.6Te3 thin films and metals, Appl. Phys. Lett., 105, 013903, |
| 2014 | H. W. Tsai*, T. H. Wang*, T. C. Chan*, P. J. Chen*, C. C. Chung*, A. Yaghoubi*, C. N. Liao, E. W.-G. Diau, Y. L. Chueh! | Fabrication of Large Scale Single Crystal Bismuth Telluride (Bi2Te3) Nanosheet Arrays by Single Step Electrolysis Process, Nanoscale, 6, 7780, |
| 2014 | T. C. Chan*, Y. M. Lin*, H. W. Tsai*, C. C. Lin*, Z. M. Wang, C. N. Liao!, Y. L. Chueh! | Growth of large-scale nanotwinned Cu nanowire arrays from anodic aluminum oxide membrane by electrochemical deposition process: Controllable nanotwin density and growth orientation with enhanced electrical endurance performance, Nanoscale, 6, 7332, |
| 2014 | P.-J. Chen* and C. N. Liao! | Thermoelectric transport properties of Bi-Te based thin films on strained polyimide substrates, Appl. Phys. Lett., 105, 133903, |
| 2014 | P.-J. Chen and C. N. Liao | “Thermoelectric transport properties of BiTe based thin films on strained polyimide substrates”, Appl. Phys. Lett., 105, 133903. |
| 2014 | T.-C. Chan*, Y.-Z. Chen*, Y.-L. Chueh!, C. N. Liao! | Large-scale nanotwins in copper films/Cu nanowires via stress engineering by high energy ion beam bombardment process: growth and characterization, J. Mater. Chem. C, 2, 9777-10038, |
| 2013 | C. N. Liao!, Y. C. Lu* and D. Xu | Modulation of crystallographic texture and twinning structure of Cu nanowires by electrodeposition, J. Electrochem. Soc., |
| 2013 | C. N. Liao!, C.-Y. Lin*, C.-L. Huang* and Y.-S. Lu* | Morphology, Texture and Twinning Structure of Cu Films Prepared by Low-temperature Electroplating, J. Electrochem. Soc., |
| 2013 | M.-P. Lu* and C. N. Liao! | Mechanical and thermal processing effects on crystal defects and thermoelectric transport properties of Bi2(Se,Te)3 compounds, J. Alloys Compd., |
| 2013 | H.-H. Huang*, M.-P. Lu*, C.-H. Chiu*, L.-C. Su*, C. N. Liao!, J.-Y. Huang, H.-L. Hsieh | Enhanced Seebeck coefficient of bismuth telluride compounds with graded doping profiles, Appl. Phys. Lett., |
| 2013 | P. H. Le*, C. N. Liao, C. W. Luo, J.-Y. Lin, J. Leu! | Thermoelectric properties of bismuth-selenide films with controlled morphology and texture grown using pulsed laser deposition, Appl. Surf. Sci, |
| 2012 | T. Y. Lin, C. N. Liao, A. T. Wu | “Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials”, J. Electron. Mat. 41, 153. |
| 2011 | S. S. Lin and C. N. Liao | “Effect of ball milling and post treatment on crystal defects and transport properties of Bi2(Se,Te)3 compounds”, J. Appl. Phys., 110, 093707. |
| 2011 | T. C. Chan, Y. L. Chueh and C. N. Liao | “Manipulating the crystallographic texture of nanotwinned Cu films by electrodeposition”, Cryst. Growth Des., 11, 4970. |
| 2011 | T. C. Chan, K. C. Chen and C. N. Liao | “Surface roughness reduction of nanocrystalline Cu thin films by electrical stressing treatment”, Appl. Phys. Lett., 98, 181902. |
| 2011 | C. N. Liao, X. W. Su, K. M. Liou and H. S. Chu | “Electrical and thermal transport properties of electrically stressed Bi-Sb-Te nanocrystalline thin films”, Thin Solid Films, 519, 4394. |
| 2011 | C. H. Lee, W. T. Chen and C. N. Liao | “Effect of antimony on vigorous interfacial reaction of Sn-Sb/Te couples”, J. Alloys Compd., 509, 5142. |
| 2010 | C. N. Liao, W. T. Chen and C. H. Lee | “Polarity effect on interfacial reactions at soldered junctions of electrically stressed thermoelectric modules”, Appl. Phys. Lett. 97, 241906. |
| 2010 | C. N. Liao, H. D. Shih and P. W. Su | “Electrocrystallization of Mutually Crossed Bismuth Telluride Nanoplatelets”, J. Electrochem. Soc. 157, D605. |
| 2010 | K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu | “Stability of nanoscale twins in copper under electric current stressing”, J. Appl. Phys. 108, 066103. |
| 2010 | K. M. Liou and C. N. Liao | “Electric current enhanced defect elimination in thermally annealed BiSbTe and BiSeTe thermoelectric thin films”, J. Appl. Phys., 108, 053711. |
| 2010 | C. N. Liao, C. Y. Chang and H. S. Chu | “Thermoelectric properties of electrically stressed Sb/Bi–Sb–Te multilayered films”, J. Appl. Phys., 107, 066103. |
| 2010 | C. N. Liao and Y. C. Huang | “Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium”, J. Mat. Res., 25, 391. |
| 2010 | C. N. Liao, L. C. Wu and J. S. Lee | “Thermoelectric properties of Bi-Sb-Te materials prepared by electric current stressing”, J. Alloys Compd., 490, 468. |
| 2009 | C. N. Liao and L. C. Wu | “Enhancement of carrier transport properties of BixSb2-xTe3 compounds by electrical sintering process”, Appl. Phys. Lett., 95, 052112. |
| 2008 | C. N. Liao, Y. C. Wang and H. S. Chu | “Thermal transport properties of nanocrystalline Bi–Sb–Te thin films prepared by sputter deposition”, J. Appl. Phys., 104, 104302. |
| 2008 | C. N. Liao and C. H. Lee | “Suppression of vigorous liquid Sn/Te reactions by Sn-Cu solder alloys”, J. Mat. Res., 23, 3303. |
| 2008 | S. D. Li, J. G. Duh and C. N. Liao | “High-frequency ferromagnetic inductors covered by as-deposited FeCoAlO films with stress-induced uniaxial anisotropy”, Thin Solid Films, 516, 7748. |
| 2008 | K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu | “Observation of Atomic Diffusion at Twin-modified Grain Boundaries in Copper”, Science, 321, 1066. |
| 2008 | C. N. Liao, K. M. Liou and H. S. Chu | “Enhancement of thermoelectric properties of sputtered Bi-Sb-Te thin films by electric current stressing”, Appl. Phys. Lett., 93, 042103. |
| 2007 | C. M. Tai and C. N. Liao | ”A Physical Model of Solenoid Inductors on Silicon Substrates”, IEEE Trans. Microwave Theory Tech., 55(12), 2579. |
| 2007 | C. N. Liao, C. H. Lee and W. J. Chen | “Effect of interfacial compound formation on contact resistivity of soldered junctions between bismuth telluride based thermoelements and copper”, Electrochem. Solid-State Lett., 10(9), P23. |
| 2007 | C. M. Chen, C. C. Huang, C. N. Liao, and K. M. Liou | “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, J. Electron. Mat. 36, 760. |
| 2007 | K. C. Chen, C. N. Liao, W. W. Wu and L. J. Chen | “Direct observation of electromigration-induced surface atomic steps in Cu lines by in-situ transmission electron microscopy”, Appl. Phys. Lett., 90, 203101. |
| 2007 | C. N. Liao and T. H. She | Preparation of bismuth telluride thin films through interfacial reaction, Thin Solid Films, 515, 8059. |
| 2007 | C. M. Tai and C. N. Liao | Multi-level suspended thin film inductors on silicon wafers, IEEE Trans. Electron. Dev., 54 (6), 1510. |
| 2007 | C. N. Liao, T. H. She, P. J. Liao and H. S. Chu | Oscillatory transport properties of thermally annealed Bi/Te multilayer thin films, J. Electrochem. Soc. 154 (4), H304. |
| 2006 | C. N. Liao, H. N. Wu, P. C. Chen and J. W. Yeh | Effect of antimony doping on thermoelectric properties of Zr0.5Ti0.5NiSn multi-element alloys, ANNALES DE CHIMIE - science des matériaux, 31(6), 711. |
| 2006 | C. N. Liao and C. T. Wei | An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples, Thin Solid Films, 515, 2781. |
| 2005 | C. N. Liao, C. P. Chung and W. T. Chen | Electromigration induced Pb Segregation in Eutectic Sn-Pb Molten Solder, J. Mat. Res., 20, 3425. |
| 2005 | C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen | In situ transmission electron microscope observations of electromigration in copper lines at room temperature, Appl. Phys. Lett., 87, 141903. |
| 2005 | C. N. Liao and K. C. Chen | Effect of interfacial resistance and contact size on current crowding at Ni/poly-Si junctions, Semi. Sci. Tech., 20, 659. |
| 2005 | C. N. Liao and S. W. Kuo | Thermoelectric characterization of sputter-deposited Bi/Te bilayer thin films, J. Vac. Sci. Tech. A, 23, 559 (SCI) |
| 2005 | C. N. Liao and K. M. Liou | Electrical properties of Cu/Ta interfaces under electrical current stressing, J. Vac. Sci. Tech. A, 23, 359. |
| 2004 | C. N. Liao and C. T. Wei | Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment, J. Electron. Mat., 33, 1137. |
| 2003 | C. N. Liao and K. C. Chen | Current crowding effect on thermal characteristics of Ni/doped-Si contacts”, IEEE Electron Device Letters, 24, 637. |
| 2002 | C. N. Liao and K. N. Tu | Direct measurement of contact temperature using Seebeck potential, J. Appl. Phys., 92, 635. |