| Phone No. | +886-3-5715131#31164 (Lab:33857) |
| Office | Materials Science & Technology Building R405, National Tsing Hua University |
| jgd@mx.nthu.edu.tw | |
| Education | Ph.D., Materials Engineering, Purdue University |
| Personal Website | http://r429jgd.wix.com/jgdlab |
| Lab | 33857 |
| Discipline |
Diffusion and Kinetic Processes, Thermodynamics of Materials, Microanalysis in Electron Microscopy, X-ray Diffraction and Crystallography, Thin Film Technology
|
| Speciality |
Multi-functional Coating and Surface Modification of Materials; Metallization and Solder Joint Reliability in Microelectronic Package; Fabrication of Advanced Cathode and Anode Materials in Li Ion Battery; Electron Microscopy and X-ray Microanalysis
|
Jenq-Gong Duh
Emeritus Professor
Work Experience
| Institution | Title | Date |
|---|---|---|
| Department of Materials Science and Engineering, National Tsing Hua University | Chair Professor | 2012 ~ |
| Materials Chemistry and Physics (Elsevier) | Co-Editor in Chief | 2019 ~ |
| Department of Materials Science and Engineering, National Tsing Hua University | Associate Professor | 1983 ~ 1989 |
| Department of Materials Science and Engineering, National Tsing Hua University | Professor | 1989 ~ 2006 |
| Department of Materials Science and Engineering, National Tsing Hua University | Distinguished Professor | 2006 ~ 2012 |
| Taiwan Association for Coatings and Thin Films Technology | President | 2014 ~ 2015 |
| Material Engineering Program, National Science Council | Convener | 2011 ~ 2013 |
| National Tsing Hua University | Dean of Students Affairs | 1994 ~ 1998 |
Inside School HonorOverview
| 得獎年度 | 獎項名稱 | 頒獎單位 |
|---|---|---|
| 2011 | Excellent Industry-university Cooperative Research Teacher | National Tsing Hua University |
Outside School HonorOverview
| 得獎年度 | 獎項名稱 | 頒獎單位 |
|---|---|---|
| 2017 | Merit MOST Research Fellow Award | Ministry of Science and Technology |
| 2015 | Lu Chih-Houng Memorial Award | Materials Research Society- Taiwan |
| 2015 | Outstanding Research in Materials Science Award | C.T. Ho Foundation |
| 2012 | Creative award in Senior Project, NSC | National Science Council |
| 2011-2013 2004-2006 1991-1992 | Outstanding Research Award | National Science Council |
Research ProjectOverview
| Year | Project Name | Participator | Job | Period | Cooperative Organization |
|---|---|---|---|---|---|
| 2020 | 創新式無鋼珠碟形滾鍍設備開發計畫 | Jenq-Gong Duh | Principal Investingator | 2020-02 | 漢瑪科技股份有限公司 |
| 2019 | 產學合作研究計畫(開發型)-Exploration and Application of Atmospheric Plasma Technique and Plasma Activated Water in Aeroponic Cultivation | Jenq-Gong Duh | PI | 2019-11 ~ 2020- 10 | Ministry of Science and Technology 甫田科技股份有 限公司 |
| 2019 | The development of high energy density and safety cathode, anode, solid electrolyte materials applied in electric vehicle and energy storage system | Jenq-Gong Duh | PI | 2019年 09月 ~ 2020年 12月 | Ministry of Science and Technology |
| 2019 | Modification of Microstructure, Grain Structure and Reliability of Micro-bump in Automotive Electronics by Adjusting Pd, Ag and Cu in Solder Alloy (3/3) | Jenq-Gong Duh | PI | 2019年08月 ~ 2020年07月 | Ministry of Science and Technology |
| 2019 | Exploration and Application of Atmospheric Pressure Plasma Technique in The Surface Engineering and Modification of Advanced Materials | Jenq-Gong Duh | PI | 2019年08月 ~ 2020年07月 | Ministry of Science and Technology |
| 2018 | Modification of Microstructure, Grain Structure and Reliability of Micro-bump in Automotive Electronics by Adjusting Pd, Ag and Cu in Solder Alloy (2/3) | Jenq-Gong Duh | PI | 2018年08月 ~ 2019年07月 | Ministry of Science and Technology |
| 2018 | Improving the global role for the Taiwanese Coating Technology among international Plasma Society | Jenq-Gong Duh | PI | 2018年01月 ~ 2018年12月 | Ministry of Science and Technology |
| 2017 | Modification of Microstructure, Grain Structure and Reliability of Micro-bump in Automotive Electronics by Adjusting Pd, Ag and Cu in Solder Alloy (1/3) | Jenq-Gong Duh | PI | 2017年08月 ~ 2018年07月 | Ministry of Science and Technology |
| 2017 | 產學合作研究計畫(先導型) - Surface modification technique via carbon overlayer and atmospheric pressure plasma jet for high capacity silicon-based anode materials for lithium-ion batteries from recycled cutting wastes of solar cell industries（2/2） | Jenq-Gong Duh | PI | 2017年 06月 ~ 2018年 05月 | Ministry of Science and Technology Kingstone Energy Technology |
| 2016 | 產學合作研究計畫(先導型)- Surface modification technique via carbon overlayer and atmospheric pressure plasma jet for high capacity silicon-based anode materials for lithium-ion batteries from recycled cutting wastes of solar cell industries（1/2） | Jenq-Gong Duh | PI | 2016年 06月 ~ 2017年 05月 | Ministry of Science and Technology Kingstone Energy Technology |
| 2016 | Development of Atmospheric Pressure Plasma Technique and Specially Designed Device for Exploration in Energy Material Application | Jenq-Gong Duh | PI | 2016年 08月 ~ 2019年 07月 | Ministry of Science and Technology |
| 2016 | Elemental Distribution, Grain Orientation and Mechanical Reliability of Microbump structure with Pd and Zn addition in Flip-chip Package (3/3) | Jenq-Gong Duh | PI | 2016年 08月 ~ 2017年 07月 | 科技部 |
| 2016 | 水溶性披覆型高分子作為黏結劑並運用於鋰鎳錳氧正極材料之鋰離子電池性能研究與失效分析 | Jenq-Gong Duh | PI | 2016年 04月 ~ 2016年 11月 | 工研院 |
| 2016 | 磷酸鋰鐵正極材料之水系塗佈製程開發研究 | Jenq-Gong Duh | PI | 2016年 04月 ~ 2017年 03月 | 成麗國際有限公司 |
| 2016 | 高電壓磷酸鋰錳正極材料之合成開發與性能探討研究 | Jenq-Gong Duh | PI | 2016年 04月 ~ 2017年 03月 | 成麗國際有限公司 |
| 2015 | SOEC新型氫電極材料的設計及性能評估 | Jenq-Gong Duh | PI | 2015年 01月 ~ 2015年 12月 | 清工計畫(研發處) |
| 2015 | 高電壓鋰鎳錳氧材料之改質與其失效檢測分析 | Jenq-Gong Duh | PI | 2015年 04月 ~ 2015年 11月 | 工研院 |
| 2015 | 光纖EPMA微觀結構量測與成份分析 | Jenq-Gong Duh | PI | 2015年 09月 ~ 2016年 02月 | 太空中心 |
| 2015 | 光纖材料定量與微觀分析 | Jenq-Gong Duh | PI | 2015年 09月 ~ 2016年 02月 | 太空中心 |
| 2015 | Development and Characterization of Multi-component and Functional Coatings with Amorphous/Crystallized Nanostructure and Nanolayered Configuration (3/3) | Jenq-Gong Duh | PI | 2015年 08月 ~ 2016年 07月 | Ministry of Science and Technology |
| 2015 | Elemental Distribution, Grain Orientation and Mechanical Reliability of Microbump structure with Pd and Zn addition in Flip-chip Package (2/3) | Jenq-Gong Duh | PI | 2015年 08月 ~ 2016年 07月 | Ministry of Science and Technology |
| 2015 | 產學合作研究計畫(先導型)- The development of waste management and high- purification technology for high capacity silicon-based anode materials for lithium-ion batteries from recycled cutting wastes of solar cell industries (3/3) | Jenq-Gong Duh | PI | 2015年 03月 ~ 2016年 02月 | Ministry of Science and Technology 國軒科技股份有 限公司 |
| 2014 | 產學合作研究計畫(先導型)- The development of waste management and high- purification technology for high capacity silicon-based anode materials for lithium-ion batteries from recycled cutting wastes of solar cell industries (2/3) | Jenq-Gong Duh | PI | 2014年 04月 ~ 2015年 03月 | Ministry of Science and Technology 全安資訊股份有 限公司 |
| 2014 | Development and Characterization of Multi-component and Functional Coatings with Amorphous/Crystallized Nanostructure and Nanolayered Configuration (2/3) | Jenq-Gong Duh | PI | 2014年 08月 ~ 2015年 07月 | Ministry of Science and Technology |
| 2014 | Elemental Distribution, Grain Orientation and Mechanical Reliability of Microbump structure with Pd and Zn addition in Flip-chip Package(1/3) | Jenq-Gong Duh | PI | 2014年 08月 ~ 2015年 07月 | Ministry of Science and Technology |
| 2014 | 產學合作研究計畫(先導型)- Development of multi functional and decorative thin film metallic glass (2/2) | Jenq-Gong Duh | PI | 2014年 11月 ~ 2015年 10月 | Ministry of Science and Technology 嘉澤端子工業股 份有限公司 |
| 2014 | SOEC新型氫電極材料的設計及性能評估 | Jenq-Gong Duh | PI | 2014年 01月 ~ 2014年 12月 | 清工計畫(研發處) |
| 2014 | 藉由水系塗佈製程改良鋰鎳錳氧循環充放電性能與高溫穩定度 | Jenq-Gong Duh | PI | 2014年 03月 ~ 2014年 11月 | 工研院 |
| 2014 | 以粉末冶金技術製備金屬玻璃薄膜合金靶材製備與可行性應用之開發 | Jenq-Gong Duh | PI | 2014年 04月 ~ 2015年 03月 | 中鋼 |
| 2014 | 打線接合材料之表面形貌與晶粒微結構分析 | Jenq-Gong Duh | PI | 2014年 07月 ~ 2014年 11月 | 工研院 |
| 2014 | 打線接合材料之微觀結構與縱深成份之鑑定分析計畫 | Jenq-Gong Duh | PI | 2014年 12月 ~ 2015年 03月 | 工研院 |
| 2014 | 微型感測器封裝用超薄載板熱壓接合技術 | Jenq-Gong Duh | PI | 2014年 12月 ~ 2015年 12月 | 工研院(電光所) |
| 2014 | 微型感測器封裝用超薄載板熱壓接合技術 | Jenq-Gong Duh | PI | 2014年 12月 ~ 2015年 12月 | 清工計畫(研發處) |
| 2014 | 打線接合材料之微觀結構與縱深成份之鑑定分析計劃 | Jenq-Gong Duh | PI | 2014年 12月 ~ 2015年 03月 | 工研院 |
| 2013 | 工程處材料學門國外參訪計畫(憑證送審) | Jenq-Gong Duh | PI | 2013年 07月 ~ 2013年 07月 | National Science Council |
| 2013 | 材料工程學門研究發展及推動計畫(3/3) | Jenq-Gong Duh | PI | 2013年 01月 ~ 2013年 12月 | National Science Council |
| 2013 | 產學合作研究計畫(開發型)- The development of waste management and high- purification technology for high capacity silicon-based anode materials for lithium-ion batteries from recycled cutting wastes of solar cell industries (1/3) | Jenq-Gong Duh | PI | 2013年 03月 ~ 2014年 02月 | National Science Council、 全安資訊股份有限公司 |
| 2013 | 102年度大專學生參與專題研究計畫 | Jenq-Gong Duh | PI | 2013年 07月 ~ 2014年 02月 | National Science Council |
| 2013 | Elemental Redistribution, Grain Orientation and Mechanical Reliability of Lead-free Solder Joints with Novel Under Bump Metallization in Flip-chip Package (3/3) | Jenq-Gong Duh | PI | 2013年 08月 ~ 2014年 07月 | National Science Council |
| 2013 | 產學合作研究計畫(先導型)- Development of multi- functional and decorative thin film metallic glass (1/2) | Jenq-Gong Duh | PI | 2013年 11月 ~ 2014年 10月 | National Science Council、 嘉澤端子工業股份有限公司 |
| 2013 | Development and Characterization of Multi-component and Functional Coatings with Amorphous/Crystallized Nanostructure and Nanolayered Configuration (1/3) | Jenq-Gong Duh | PI | 2013年 08月 ~ 2014年 07月 | National Science Council |
| 2013 | 晶向結構與成份分析計畫 | Jenq-Gong Duh | PI | 2013年 03月 ~ 2013年 04月 | 聖為國際法律事務所 |
| 2013 | 電極材料複合型披覆膜層的結構與性質之場效機變性研究 | Jenq-Gong Duh | PI | 2013年 04月 ~ 2013年 11月 | 工研院 |
| 2013 | 薄膜電橋設計製作研究(102年度) | Jenq-Gong Duh | PI | 2013年 06月 ~ 2013年 11月 | 中科院 |
| 2013 | 爆炸箔飛片設計製作研究(102年度) | Jenq-Gong Duh | PI | 2013年 06月 ~ 2013年 11月 | 中科院 |
| 2013 | 利用金屬摻雜提升鈦酸鋰低溫電化學性能並以第一原理模擬預測材料特性(102年) | Jenq-Gong Duh | PI | 2013年 07月 ~ 2013年 12月 | 經濟部能源局 |
| 2013 | SOEC新型氫電極材料的設計及性能評估 | Jenq-Gong Duh | PI | 2013年 01月 ~ 2013年 12月 | 清工計畫(研發處) |
| 2012 | 材料工程學門研究發展及推動計畫(2/3) | Jenq-Gong Duh | PI | 2012年 01月 ~ 2013年 12月 | National Science Council |
| 2012 | Elemental Redistribution, Grain Orientation and Mechanical Reliability of Lead-free Solder Joints with Novel Under Bump Metallization in Flip-chip Package (2/3) | Jenq-Gong Duh | PI | 2012年 08月 ~ 2013年 07月 | National Science Council |
| 2012 | The effect of phosphorus contents in Ni-based under bump metallization of filp chip structure (2/2) | Jenq-Gong Duh | PI | 2012年 06月 ~ 2013年 05月 | National Science Council、 景碩科技股份有限公司 |
| 2012 | Development and Characterization of Novel Nanostructure Nitride Hard Coatings with Amorphous/Crystallized SiNx Nanolayered Configuration (3/3) | Jenq-Gong Duh | PI | 2012年 08月 ~ 2013年 07月 | National Science Council |
| 2012 | 無機/有機組合式氮化物奈米複合膜改質電極表面之研究 | Jenq-Gong Duh | PI | 2012年 04月 ~ 2012年 11月 | 工材所 |
| 2012 | 薄膜電橋設計製作研究(101年度) | Jenq-Gong Duh | PI | 2012年 06月 ~ 2012年 11月 | 中科院 |
| 2012 | 爆炸箔飛片設計至做研究(101年度) | Jenq-Gong Duh | PI | 2012年 06月 ~ 2012年 11月 | 中科院 |
| 2012 | 液態金屬玻璃薄膜與靶材開發 | Jenq-Gong Duh | PI | 2012年 09月 ~ 2013年 08月 | 中鋼 |
| 2012 | 過渡金屬摻雜改質對於鈦酸鋰電性提升之影響與機制之探討 | Jenq-Gong Duh | PI | 2012年 03月 ~ 2013年 02月 | 芯和公司 |
| 2011 | Elemental Redistribution, Grain Orientation and Mechanical Reliability of Lead-free Solder Joints with Novel Under Bump Metallization in Flip-chip Package (1/3) | Jenq-Gong Duh | PI | 2011年08月 ~ 2012年07月 | National Science Council |
| 2011 | 產學合作研究計畫(先導型)- The effect of phosphorus contents in Ni-based under bump metallization of filp chip structure (1/2) | Jenq-Gong Duh | PI | 2011年06月 ~ 2012年05月 | National Science Council、 景碩科技股份有限公司 |
| 2011 | Development and Characterization of Novel Nanostructure Nitride Hard Coatings with Amorphous/Crystallized SiNx Nanolayered Configuration(2/3) | Jenq-Gong Duh | PI | 2011年08月 ~ 2012年07月 | National Science Council |
| 2010 | Development and Characterization of Novel Nanostructure Nitride Hard Coatings with Amorphous/Crystallized SiNx Nanolayered Configuration(1/3) | Jenq-Gong Duh | PI | 2010年08月 ~ 2011年07月 | National Science Council |
| 2010 | 產學合作研究計畫(應用型)- Development of binary Pd-Ni alloy for BGA substrates surface finish by electroplating | Jenq-Gong Duh | PI | 2010年11月 ~ 2011年10月 | National Science Council、 宥豪股份有限公司 |
| 2010 | 高頻電力與信號傳輸元件之薄膜化與材料技術計畫 ﹝III﹞ | Jenq-Gong Duh | PI | 2010年10月 ~ 2011年07月 | 經濟部學界科專 |
| 2010 | Investigation of Novel Ni-X (X=Cu, Ti, W, Cr)and Cu-Y (Y=Ni, Co, Zr)Under Bump Metallization Systems Prepared by DC Magnetron Sputtering (3/3) | Jenq-Gong Duh | PI | 2010年 08月 ~ 2011年 07月 | National Science Council |
| 2009 | Fabrication and Characterization of Novel Multi-component Nitride Hard Coating with Nanocomposite and Nanolayered Configuration (3/3) | Jenq-Gong Duh | PI | 2009年 08月 ~ 2010年 07月 | National Science Council |
| 2009 | Investigation of Novel Ni-X (X=Cu, Ti, W, Cr)and Cu-Y (Y=Ni, Co, Zr)Under Bump Metallization Systems Prepared by DC Magnetron Sputtering (2/3) | Jenq-Gong Duh | PI | 2009年 08月 ~ 2010年 07月 | National Science Council |
| 2009 | 高頻電力與信號傳輸元件之薄膜化與材料技術計畫﹝II﹞ | Jenq-Gong Duh | PI | 2009年 10月 ~ 2010年 09月 | 經濟部學界科專 |
| 2009 | 高頻電力與信號傳輸元件之薄膜化與材料技術三年計畫(第2年) | Jenq-Gong Duh | PI | 2009年 07月 ~ 2010年 06月 | 經濟部學界科專 |
| 2009 | CISCO委託分析計畫(II) | Jenq-Gong Duh | PI | 2009年 03月 ~ 2011年 02月 | 美國CISCO公司 |
| 2009 | 產學合作研究計畫(開發型)- IC測試用金屬內插器抗沾黏鍍層的開發 | Jenq-Gong Duh | PI | 2009年 12月 ~ 2010年 11月 | National Science Council 追日潤股份有限公司 |
| 2009 | 光纖EPMA微觀結構與成份分析 | Jenq-Gong Duh | PI | 2009年 07月 ~ 2009年 10月 | 太空中心 |
| 2008 | CISCO委託分析計畫 | Jenq-Gong Duh | PI | 2008年 03月 ~ 2009年 02月 | 美國CISCO公司 |
| 2008 | 高頻電力與信號傳輸元件之薄膜化與材料技術三年計畫(第2期)第一年度 | Jenq-Gong Duh | PI | 2008年 07月 ~ 2009年 06月 | 經濟部學界科專 |
| 2008 | Fabrication and Characterization of Novel Multi-component Nitride Hard Coating with Nanocomposite and Nanolayered Configuration (2/3) | Jenq-Gong Duh | PI | 2008年 08月 ~ 2009年 07月 | National Science Council |
| 2008 | Investigation of Novel Ni-X (X=Cu, Ti, W, Cr)and Cu-Y (Y=Ni, Co, Zr)Under Bump Metallization Systems Prepared by DC Magnetron Sputtering (1/3) | Jenq-Gong Duh | PI | 2008年 08月 ~ 2009年 07月 | National Science Council |
| 2008 | 高頻電力與信號傳輸元件之薄膜化與材料技術第二期計畫﹝I﹞ | Jenq-Gong Duh | PI | 2008年 08月 ~ 2009年 07月 | 經濟部學界科專 |
| 2007 | Fabrication and Characterization of Novel Multi-component Nitride Hard Coating with Nanocomposite and Nanolayered Configuration (1/3) | Jenq-Gong Duh | PI | 2007年 08月 ~ 2008年 07月 | National Science Council |
| 2007 | 電力元件磁性材料研究 | Jenq-Gong Duh | PI | 2007年 08月 ~ 2009年 07月 | 台達電子工業股份有限公司 |
| 2006 | 以化學合成法及改良多段式MA製備奈米結構之Sn-Ag-X(X=Cu,Ni,Cu6Sn5,and Ni3Sn4)無鉛銲錫及其相關特性探討(2/2) | Jenq-Gong Duh | PI | 2006年08月 ~ 2007年07月 | National Science Council |
| 2006 | 具奈米複合及積層結構氮化物硬膜之製作與特性分析(2/2) | Jenq-Gong Duh | PI | 2006年08月 ~ 2007年07月 | National Science Council |
| 2006 | 高頻通訊元件及高性能材料技術計畫﹝V ﹞ | Jenq-Gong Duh | PI | 2006年09月 ~ 2007年08月 | 經濟部學界科專 |
| 2005 | 具奈米複合及積層結構氮化物硬膜之製作與特性分析(1/2) | Jenq-Gong Duh | PI | 2005年08月 ~ 2006年07月 | National Science Council |
| 2005 | 以化學合成法及改良多段式MA製備奈米結構之Sn-Ag-X (X = Cu, Ni, Cu6Sn5, and Ni3Sn4)無鉛銲錫及其相關特性探討(1/2) | Jenq-Gong Duh | PI | 2005年08月 ~ 2006年07月 | National Science Council |
| 2005 | 高頻通訊元件及高性能材料技術五年計畫(IV) | Jenq-Gong Duh | PI | 2005年08月 ~ 2006年07月 | 經濟部學界科專 |
| 2004 | 三元鎳磷基薄膜製程開發與特性分析(2/2) | Jenq-Gong Duh | PI | 2004年08月 ~ 2005年09月 | National Science Council |
| 2004 | 以MA及改良之二段式研磨製作Sn-Ag-X錫膏及其與UBM之界面反應之相關特性探討(2/2) | Jenq-Gong Duh | PI | 2004年08月 ~ 2005年07月 | National Science Council |
| 2004 | 高頻通訊元件及高性能材料技術五年計畫(III) | Jenq-Gong Duh | PI | 2004年08月 ~ 2005年07月 | 經濟部學界科專 |
| 2003 | 以MA及改良之二段式研磨製作Sn-Ag-X錫膏及其與UBM之界面反應之相關特性探討(1/2) | Jenq-Gong Duh | PI | 2003年08月 ~ 2004年07月 | 行政院國家科學委員會 |
| 2003 | 三元鎳磷基薄膜製程開發與特性分析(1/2) | Jenq-Gong Duh | PI | 2003年08月 ~ 2004年07月 | National Science Council |
| 2003 | 高頻通訊元件及高性能材料技術(II) | Jenq-Gong Duh | PI | 2003年06月 ~ 2004年05月 | 經濟部學界科專 |
| 2002 | 前瞻三元無電鍍與磁控濺鍍鎳磷基薄膜研究 | Jenq-Gong Duh | PI | 2002年08月 ~ 2003年07月 | National Science Council |
| 2002 | 以MA製作無鉛銲錫錫膏之相關特性探討 | Jenq-Gong Duh | PI | 2002年08月 ~ 2003年07月 | National Science Council |
| 2001 | 無電鍍鎳介層改質氮化鉻複合鍍層之機械性質及其破壞型態即時分析研究 | Jenq-Gong Duh | PI | 2001年08月 ~ 2002年07月 | National Science Council |
| 2001 | 高密度多層構裝基板與接合材料研究(Ⅲ)--子計畫一--無電鍍Ni/Au與銲錫界面之介金屬化合物的相變化與再溶解機制探討(Ⅲ) | Jenq-Gong Duh | PI | 2001年08月 ~ 2002年07月 | National Science Council |
| 2000 | 氮化鉻/ 無電鍍鎳/ 碳鋼複合鍍層之刮痕與耐磨耗特性評估 | Jenq-Gong Duh | PI | 2000年08月 ~ 2001年07月 | National Science Council |
| 2000 | 高密度多層構裝基板與接合材料研究--子計畫一--無電鍍NI/AU與UBM界面之介金屬化合物成長機制與銲點凸塊破裂模式 | Jenq-Gong Duh | PI | 2000年08月 ~ 2001年07月 | National Science Council |
| 1999 | 高密度多層構裝基板與接合材料研究--子計畫一:球柵陣列銲點凸塊與無電鍍NI/AU金屬化層之冶金反應與界面破裂 | Jenq-Gong Duh | PI | 1999年08月 ~ 2000年07月 | National Science Council |
| 1999 | 鋇系Ｘ頻微波介電陶瓷 | Jenq-Gong Duh | PI | 1999年07月 ~ 2000年06月 | 國科會國防科技計劃 (中科院代辦) |
| 1998 | 高密度電子構裝接合與測試載具之開發(III)--子計畫一:無鉛焊錫之潤溼性與銲之元素擴散分布 | Jenq-Gong Duh | PI | 1998年08月 ~ 1999年07月 | National Science Council |
| 1998 | 微波介電陶瓷材料之研製 | Jenq-Gong Duh | PI | 1998年07月 ~ 1999年06月 | National Science Council |
| 1997 | 鍍覆CRN 工具鋼的關鍵機械性質與環境因子的量測 | Jenq-Gong Duh | PI | 1997年08月 ~ 1998年07月 | National Science Council |
| 1997 | 高密度電子構裝接石與測試載具之開發--子計畫一：無鉛焊錫接點反應介層之擴散與界面遷移之研究(II) | Jenq-Gong Duh | PI | 1997年08月 ~ 1998年07月 | National Science Council |
| 1996 | 高密度電子構裝接合與測試載具之開發--子計畫三:無鉛焊錫接點反應介層之擴散與界面遷移之研究(I) | Jenq-Gong Duh | PI | 1996年08月 ~ 1997年07月 | National Science Council |
| 1996 | 鍍覆(TI,AL)N之合金工具鋼的耐磨耗、擴散行為與關鍵機械性質之量測 | Jenq-Gong Duh | PI | 1996年08月 ~ 1997年07月 | National Science Council |
| 1995 | 鍍覆(Ti,Al)N之合金工具鋼的氧化與腐蝕行為 | Jenq-Gong Duh | PI | 1995年08月 ~ 1996年07月 | National Science Council |
| 1995 | 多晶片模組之基板製程與晶片接合技術的研究--微電子構裝中無鉛焊錫接點之微觀分析（II） | Jenq-Gong Duh | PI | 1995年 08月 ~ 1996年 07月 | National Science Council |
| 1995 | (Ti,Al)N鍍層之研發及其機械性質與磨耗行為 | Jenq-Gong Duh | PI | 1995年02月 ~ 1995年07月 | National Science Council |
| 1994 | 多晶片膜組之基板的製成與晶片接合研究--多晶片模組之基板製成與晶片接合技術的研究:子計畫二-微電子構裝中無鉛焊錫接點之微觀分析(I) | Jenq-Gong Duh | PI | 1994年08月 ~ 1995年07月 | National Science Council |
| 1994 | 毫米波吸收材料之研製 | Jenq-Gong Duh | PI | 1994年07月 ~ 1995年06月 | National Science Council |
| 1994 | 科技報導節目主題內容規劃「材料科技與人類文明」 | Jenq-Gong Duh | PI | 1994年05月 ~ 1994年07月 | National Science Council |
| 1994 | (Ti,Al)N鍍層之研發及其機械性質與磨耗行為 | Jenq-Gong Duh | PI | 1994年02月 ~ 1995年01月 | National Science Council |
| 1993 | 氧化鈰氧化釔氧化鋯陶瓷體的化學式表面處理 | Jenq-Gong Duh | PI | 1993年08月 ~ 1994年07月 | National Science Council |
| 1993 | TiN/Ni3P/Fe複合鍍層的機械性質與腐蝕行為 | Jenq-Gong Duh | PI | 1993年02月 ~ 1994年02月 | National Science Council |
| 1992 | 以溶膠滲透法改質二氧化鋯陶瓷體 | Jenq-Gong Duh | PI | 1992年08月 ~ 1993年07月 | National Science Council |
| 1992 | 改質後碳鋼表面之氮化鈦鍍膜的結構與特性 | Jenq-Gong Duh | PI | 1992年02月 ~ 1993年01月 | National Science Council |
| 1991 | 高韌化熱穩定性之含Ｃｅ修飾之二氧化鋯陶瓷體 | Jenq-Gong Duh | PI | 1991年08月 ~ 1992年07月 | National Science Council |
| 1990 | 人工牙根之研製：人工陶瓷牙根 | Jenq-Gong Duh | PI | 1990年08月 ~ 1991年07月 | National Science Council |
| 1990 | 藉二氧化鈰擴散與滲透法予含釔二氧化鋯之表面改質 | Jenq-Gong Duh | PI | 1990年 08月 ~ 1991年 07月 | National Science Council |
| 1990 | 微波鐵氧磁體之研製與磁性 | Jenq-Gong Duh | PI | 1990年 09月 ~ 1992年 02月 | National Science Council |
| 光纖材料定性定量分析 | Jenq-Gong Duh | 2004年 01月 ~ 2004年 12月 | 卓越光纖股份有限公司 | ||
| 光電材料定性定量分析 | Jenq-Gong Duh | 2004年 03月 ~ 2004年 08月 | 遠茂光電股份有限公司 | ||
| 以共沈法製備鋰錳基氧化物粉末及正極材料的表面改質技術 | Jenq-Gong Duh | 2004年 01月 ~ 2004年 12月 | 康普材料科技股份有限公司 | ||
| 壓模材料性質定性定量分析 | Jenq-Gong Duh | 2004年 04月 ~ 2004年 08月 | 一品光學股份有限公司 | ||
| 塊狀非晶質鐵基磁性合金研究開發 | Jenq-Gong Duh | 2004年 03月 ~ 2004年 11月 | 工研院工材所 | ||
| 應用於光學玻璃膜造製程之奈米二元過渡金屬氮化物鍍膜開發 | Jenq-Gong Duh | 2005年 01月 ~ 2005年 12月 | 工研院光電所 | ||
| 石英元件薄膜製程技術與封裝熱管理技術之研究 | Jenq-Gong Duh | 2006年 01月 ~ 2007年 04月 | 台灣晶技股份有 限公司 | ||
| 無鉛鍍層微觀結構分析 | Jenq-Gong Duh | 2006年 01月 ~ 2006年 04月 | 鴻海精密工業股份有限公司 | ||
| 石英元件薄膜製程技術與封裝熱管理技術之研究 | Jenq-Gong Duh | 2006年- 01月 ~ 2007年- 04月 | 台灣晶技股份有 限公司 | ||
| 以無電鍍法製備鋰離子二次電池錫碳複合負極材料及其相關特性探討 | Jenq-Gong Duh | 2006年- 09月 ~ 2008年- 08月 | 工材所 |
Journal Articles
| Author | Title | Date |
|---|---|---|
| J. W. Lee!, C. C. Hong*, H. W. Chen*, L. W. Ho*, J. G. Duh, and Y. C. Chan | The influence of boron contents on the microstructure and mechanical properties of Cr–B–N thin films, Vacuum 87, | 2013 |
| Y. C. Chan*, H. W. Chen*, P. S. Chao*, J. G. Duh!, and J. W. Lee | Microstructure control in TiAlN/SiNx multilayers with appropriate thickness ratios for improvement of hardness and anti-corrosion characteristics, Vacuum 87 , | 2013 |
| C. F. Tseng*, and J. G.Duh! | The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction, Journal of Materials Science 48 , | 2013 |
| C. Y. Ho*, and J. G. Duh! | Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder, Materials Letters 92, | 2013 |
| Y. C. Jin*, and J. G. Duh! | Nanostructured LiNi0.5Mn1.5O4 cathode material synthesized by polymer-assisted co-precipitation method with improved rate capability, Materials Letters 93, | 2013 |
| C. Y. Yu*, W. C. Lu, J. G. Duh, and S. O. Chen | Study of the Zn occupancy leading to the stability improvement for Cu6Sn5 using a first-principles approach, Materials Letters 93, | 2013 |
| C. Y. Ho*, J. G. Duh!, C. W. Lin, C. J. Lin, Y. H. Wu*, H. C. Hong, and T. H. Wang | Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit, Journal of Materials Science 48, | 2013 |
| T. K. Lee!, B. Zhou*, T. R. Bieker, C. F. Tseng*, and J. G. Duh | The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance, Journal of Electronics Materials 42 , | 2013 |
| C. Y. Chuang*, Y. C. Liao*, J. W. Lee!, C. L. Li*, J. P. Chu, and J. G. Duh | Electrochemical characterization of Zr-based thin film metallic glass in hydrochloric aqueous solution, Thin Solid Film, | 2013 |
| S. D. Li!, M. Liu*, W. Shao*, J. Xu, S. Chen, Z. Zhou*, T. Nan*, N. X. Sun, and J. G. Duh | Large E-field tunability of microwave ferromagnetic properties in Fe50Co50-Hf/lead zinc niobate–lead titanate multiferroic laminates, Journal of Applied Physics, | 2013 |
| S. D. Li!, H. Du*, Q. Xue*, S. Xie*, M. Liu*, W. Shao*, J. Xu, T. Nan*, N. X. Sun, and J. G. Duh | Stress competition and vortex magnetic anisotropy in FeCoAlO high-frequency soft magnetic films with gradient Al-O contents, Journal of Applied Physics, | 2013 |
| C. F. Tseng*, C. J. Lee*, and J. G. Duh! | Roles of Cu in Pb-free Solders Jointed with Electroless Ni(P) Plating, Materials Science and Engineering A , | 2013 |
| Y. H. Wu*, C. Y. Yu*, C. Y. Ho* and J. G. Duh! | Retardation of (Cu, Ni)6Sn5 spalling in Sn-Ag-Cu/Ni solder joints via controlling the grain structure of Ni metallization layer, Materials Letters, | 2013 |
| C. F. Tseng* and J. G. Duh! | Correlation between Microstructure Evolution and Mechanical Strength in the Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint, Materials Science and Engineering A , | 2013 |
| S. D. Li!, M. Liu*, J. Lou*, X. Xing*, J. P. Wu*, Y. Hu*, X. L. Cai*, F. Xu*, N. X. Sun, and J. G. Duh | Microwave Frequency Performance and High Magnetic Anisotropy of Nanocrystalline Fe70Co30-B Films Prepared by Composition Gradient Sputtering, journal of nanoscience and nanotechnology, | 2013 |
| S. D. Li!, M. Liu*, J. Lou*, X. Xing*, J. Qiu*, J. H. Lin*, Z. Y. Cai*, F. Hu*, N. X. Sun, and J. G. Duh | Tunable Microwave Frequency Performance of Nanocomposite Co2MnSi/PZN-PT Magnetoelectric Coupling Structure, journal of nanoscience and nanotechnology, | 2013 |
| P. S. Chen*, H. W. Chen*, J. G. Duh!, J. W. Lee, J.S.C. Jang | Characterization of mechanical properties and adhesion of Ta–Zr–Cu–Al–Ag thin film metallic glasses, Surface & Coatings Technology, | 2013 |
| S. F. Chen*, Y. C. Kuo*, C. J. Wang*, S. H. Huang*, J. W. Lee!, Y. C. Chan*, H. W. Chen*, J. G. Duh, T. E. Hsieh | The effect of Cr/Zr chemical composition ratios on the mechanical properties of CrN/ZrN multilayered coatings deposited by cathodic arc deposition system, Surface & Coatings Technology, | 2013 |
| C. Y. Tong*, J. W. Lee!, C. C. Kuo*, S. H. Huang*, Y. C. Chan*,H.W. Chen*, J.G. Duh | Effects of carbon content on the microstructure and mechanical property of cathodic arc evaporation deposited CrCN thin films, Surface & Coatings Technology, | 2013 |
| Y. C. Chan*, H. W. Chen*, Y. Z. Tsai*, J. G. Duh!, J. W. Lee | Texture microstructure and anti-wear characteristics in isostructural CrAlSiN/W2N multilayer coatings, Thin Solid Films , | 2013 |
| L. W. Ho*, J. W. Lee!, H. W. Chen*, Y. C. Chan*, J. G. Duh | Structure and mechanical property evaluation of Cr–Ti–B–N coatings, Thin Solid Films , | 2013 |
| Y.C. Chan*, H.W. Chen*, R.H. Wei, J.W. Lee, J.G. Duh ! | Effects of Al and V additions on mechanical response in thick TiSiCN nanocomposites deposited using a plasma enhanced magnetron sputtering, Jpn. J. Appl. Phys, | 2013 |
| H. M. Lin*, and J. G. Duh! | Development of electroplated Ni–xZn films for under bump metallization application, Surface and Coatings Technology , | 2013 |
| Shang-I Chung* and Jenq-Gong! | Exploration of Surface Hydrophilic Properties on AISI 304 stainless steel and silicon wafer against aging after atmospheric pressure plasma treatment, Japanese Journal of Applied Physics, | 2014 |
| Jia-Hong Chu*, Joseph Lee*, Chun-Chi Chang*, Yu-Chen Chan*, Ming-Li Liou*, Jyh-Wei Lee, Jason Shian-Ching Jang, Jenq-Gong Duh! | Antimicrobial characteristics in Cu-containing Zr-based thin film metallic glass, Surface and Coatings Technology, | 2014 |
| H. W. Chen*, K. C. Hsu*, Y. C. Chan*, J. G. Duh! | J. W. Lee, Jason S. C. Jang, G. J. Chen, | 2014 |
| J. H. Chu*, H. W. Chen*, Y. C. Chan*, J. G. Duh!, J. W. Lee, Jason S. C. Jang | Modification of structure and property in Zr-based thin film metallic glass via processing temperature control, Thin Solid Films, | 2014 |
| Y. C. Chan* , H. W. Chen*, J. G. Duh!, J. W. Lee | Texture, microstructure and tribological behavior in TiAlN/SiNx multilayers, Int. J. Appl. Ceram. Technol., | 2014 |
| C. Y. Yu*, W. Y. Chen*, and J. G. Duh! | Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testing, Journal of Alloys and Compounds, 586, (2014) 633-638, | 2014 |
| C. Y. Yu*, Joseph Lee*, W. L. Chen*, and J. G. Duh! | Enhancement of the impact toughness in Sn-Ag-Cu/Cu solder joints via modifying the microstructure of solder alloy, Materials Letters 119 (2014) 20–23, | 2014 |
| W. Y. Chen*, C. Y. Yang*, and J. G. Duh! | Improving the shear strength of Sn-Ag-Cu-Ni/Cu-Zn solder joints via modifying the microstructure and phase stability of Cu-Sn intermetallic compounds, Intermetallics, 54 (2014) 181–186, | 2014 |
| C.Y. Ho*, M.T. Tsai*, J. G. Duh!, and J.W. Lee, | Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies, Journal of Alloys and Compounds, 600, (2014) 199-203., | 2014 |
| C. Y. Ho* and J.G. Duh! | Optimal Ni(P) Thickness Design in Ultrathin-ENEPIG Metallization for Soldering: Concerning Electrical Impedance and Mechanical Bonding Strength, Materials Science and Engineering A 611 (2014) 162-169, | 2014 |
| C. F. Tseng*, C. Y. Ho*, J. Lee*, and J. G. Duh! | Crystallographic characterization and growth behavior of (Cu,Ni,Pd)6Sn5 intermetallic compound in Ni(P)/Pd/Au/SnAgCu/Cu assembled solder joint, Journal of Alloys and Compounds, | 2014 |
| C. Y. Ho* and J. G. Duh! | Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of the Cu-Sn intermetallic compounds in soldering reaction, Materials Chemistry and Physics 148 (2014) 21-27, 2014 | 2014 |
| Wen-Lin Chen*, Chi-Yang Yu*, Cheng-Ying Ho* and Jenq-Gong Duh! | Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints, Materials Science and Engineering A 613(8) (2014) 193–200, | 2014 |
| Wei-Yu Chen*, Wei Tu* , Hsiang-Ching Chang* , Tzu-Ting Choua* and Jenq-Gong Duh! | Growth orientation of Cu-Sn IMC in Cu/Sn-3.5Ag/Cu-xZn microbumps and Zn-doped solder joints, Materials letters 134 (2014) 184-186, | 2014 |
| Yi-Chun Jin*, Jenq-Gong Duh! | Feasible Nonaqueous Route to Synthesize High-Voltage Spinel Cathode Material for Lithium Ion Battery, RSC Adv., 2015,5, 6919-6924, | 2015年 |
| Wei-Yu Chen*, Tzu-Ting Chou*, Wei Tu* , Hsiang-Ching Chang,* Christine Jill Lee* and Jenq-Gong Duh! | Retarding the Cu–Sn and Ag–Sn intermetallic compounds by applying Cu–xZn alloy on micro-bump in novel 3D-IC technologies, Journal of Materials Science: Materials in Electronics, | 2015年 |
| Chun-Kai Lan*, Shang-I Chuang*, Qi Bao*, Yen-Ting Liao* and Jenq-Gong Duh! | One-Step Argon/Nitrogen Binary Plasma Jet Irradiation of Li4Ti5O12 for Stable High-Rate Lithium Ion Battery Anodes | 2015年 |
| Yao-Hui Huang*, Qi Bao*, Bing-Hong Chen*, and Jenq-Gong Duh! | Nano-to-Microdesign of Marimo-Like Carbon Nanotubes Supported Frameworks via In-spaced Polymerization for High Performance Silicon Lithium Ion Battery Anodes | 2015年 |
| Qi Bao*, Yao-Hui Huang*, Chun-Kai Lan*, Bing-Hong Chen* and Jenq-Gong Duh! | Scalable Upcycling Silicon from Waste Slicing Sludge for High-performance Lithium-ion Battery Anodes | 2015年 |
| Yao-Hui Huang*, Chih-Tse Chang*, Qi Bao*, Jenq-Gong Duh! and Yu-Lun Chueh | Heading towards Novel Superior Silicon-based Lithium-ion Batteries: Ultrasmall Nanoclusters Top-down Dispersed over Synthetic Graphite Flakes as Binary Hybrid Anode | 2015年 |
| Bing-Hong Chen*, Shang-I Chuang*, Wei-Ren Liu!, and Jenq-Gong Duh! | A Revival of Waste: Atmospheric Pressure Nitrogen Plasma Jet Enhanced Jumbo Silicon/Silicon Carbide Composite in Lithium Ion Batteries | 2015年 |
| Chun-Kai Lan*, Chun-Chi Chang*, Cheng-Yu Wu*, Bing-Hong Chen* and Jenq-Gong Duh! | Improvement of the Ar/N2 binary plasma-treated carbon passivation layer deposited on Li4Ti5O12 electrodes for stable high-rate lithium ion battery | 2015年 |
| Hao Yang*, Chun-Kai Lan*, and Jenq-Gong Duh! | The Power of Nb-substituted TiO2 in Li-ion Batteries: Morphology Transformation Induced by High Concentration Substitution | 2015年 |
| Wei-Yu Chou*, Yi-Chun Jin*, Jenq-Gong Duh!, Cheng-Zhang Lu, Shih-Chieh Liao | A facile approach to derive binder protective film on high voltagespinel cathode materials against high temperature degradation | 2015年 |
| Hsiu-Min Lin*, Cheng-Ying Ho*, Wen-Lin Chen*, Yi-Hsin Wu*, De-Hui Wang*, Jun-Ren Lin*, Yu-Hui Wu*, Huei-Cheng Hong*, Zhi-Wei Lin*, Jenq-Gong Duh! | Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test | 2015年 |
| Christine Jill Lee*, Wei-Yu Chen*, Tzu-Ting Chou*, Tae-Kyu Lee*, Yew-Chung Wu, Tao-Chih Chang and Jenq-Gong Duh! | The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test | 2015年 |
| Chun-Chi Chang*, Hsien-Wei Chen*, Jyh-Wei Lee, Jenq-Gong Duh! | Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment | 2015年 |
| Joseph Lee*, Kuo-Hua Huang*, Kai-Chieh Hsu*, Huan-Chien Tung*, Jyh-Wei Lee and Jenq-Gong Duh! | Applying Composition Control to Improve the Mechanical and Thermal Properties of Zr-Cu-Ni-Al Thin Film Metallic Glass by Magnetron DC Sputtering | 2015年 |
| Joseph Lee*, Huan-Chien Tung*, and Jenq-gong Duh! | Enhancement of Mechanical and Thermal Properties in Zr-Cu-NI-Al-N Thin Film Metallic Glass by Compositional Control of Nitrogen | 2015年 |
| Chun-Chi Chang*, Hsien-Wei Chen*, Jyh-Wei Lee and Jenq-Gong Duh! | Influence of Si contents on tribological characteristics of CrAlSiN nanocomposite coatings | 2015年 |
| Kuo-Hua Huang*! and Jenq-Gong Duh | Thermal Effect on Lifetime Evaluation of Adhesiveless Copper-Polyimide | 2015年 |
| Kuo-Hua Huang* and Jenq-Gong Duh! | Fatigue Characterization for Flexible Circuit with Polyimide on Adhesiveless Copper | 2015年 |
| Jason Shian-Ching Jang!, Pei-Hua Tsai*, An-Zin Shiao*, Tsung-Hsiung Li*, Chih-Yu Chen*, Jinn Peter Chu!, Jenq-Gong Duh, Ming-Jen Chen, Shih-Hsin Chang, Wen-Chien Huang | Enhanced Cutting Durability of Surgical Blade by Coating with Fe-based Metallic Glass Thin Film | 2015年 |
| Y. C. Chang*, S. N. Hsiao*!, S. H. Liu*, S. H. Su*, K. F. Chiu, W. C. Hsieh, S. K. Chen, Y. G. Lin!, H. Y. Lee, C. K. Sung and Jenq-Gong Duh! | Effect of L12 Ordering in Antiferromagnetic Ir-Mn Epitaxial Layer on Exchange Bias of FePd Films | 2015年 |
| Chun-Chi Chang* and Jenq-Gong Duh! | Duplex Coating Technique to Improve the Adhesion and Tribological Properties of CrAlSiN Nanocomposite Coating | 2016年 |
| Bing Hong Chen*, Shang I Chaung* and Jenq Gong Duh! | Double-Plasma Enhanced Carbon Shield for Spatial/Interfacial Controlled Electrodes in Lithium Ion Batteries via Micro-Sized Silicon from Wafer Waste | 2016年 |
| Ching Yu Yang*, Yu Hsiang Lo*, Chang Liu*, Hsin-Ming Cheng, Jenq-Gong Duh and Po-Yu Chen! | Rapid Deposition of Superhydrophilic Stalagmite-like Protrusions for Underwater Selective Superwettability | 2016年 |
| Qi Bao*!, Kwan San Hui*! and Jeng-Gong Duh | Promoting catalytic ozonation of phenol over graphene through nitrogenation and Co3O4 compositing | 2016年 |
| Cheng-Yu Wu*, Chun-Chi Chang* and Jenq Gong Duh! | Silicon nitride coated silicon thin film on three dimensions current collector for lithium ion battery anode | 2016年 |
| Yao-Hui Huang*, Qi Bao*, Jenq-Gong Duh! and Chih-Tse Chang* | Top-down Dispersion Meets Bottom-up Synthesis: Merging Ultranano Silicon and Graphene Nanosheets for Superior Hybrid Anodes in Lithium-ion Batteries | 2016年 |
| Hao Yang* and Jenq-Gong Duh! | Aqueous sol-gel synthesized anatase TiO2 nanoplates with high-rate capabilities for Lithium-ion and Sodium-ion battery | 2016年 |
| Chun-Kai Lan*, Qi Bao*, Yao-Hui Huang* and Jenq-Gong Duh! | Embedding Nano-Li4Ti5O12 in Hierarchical Porous Carbon Matrixes Derived from Water Soluble Polymers for Ultra-fast Lithium Ion Batteries Anodic Materials | 2016年 |
| Yin Wang*, Jyh-Wei Lee and Jenq-Gong Duh! | Mechanical strengthening in self-lubricating CrAlN/VN multilayer coatings for improved high-temperature tribological characteristics | 2016年 |
| Ching-Yu Yang*, Shang-I Chuang*, Yu-Hsiang Lo*, Hsin-Ming Cheng, Jenq-Gong Duh and Po-Yu Chen! | Stalagmite-like Self-cleaning Surfaces Prepared by Silanization of Plasma-assisted Metal-oxide Nanostructures | 2016年 |
| Yi-Chun Jin* and Jenq-Gong Duh! | Fluorination Induced the Surface Segregation of High Voltage Spinel on Lithium-Rich Layered Cathodes for Enhanced Rate Capability in Lithium Ion Batteries | 2016年 |
| Yan Wang*, Hao Yang*, Cheng-Yu Wu* and Jenq-Gong Duh! | Facile and controllable one-pot synthesis of nickel-doped LiMn0.8Fe0.2PO4 nanosheets as high performance cathode materials for lithium-ion batteries | 2017年 |
| Bih-Show Lou, Yi-Yuan Lin, Chuan-Ming Tseng, Yu-Chu Lu*, Jenq-Gong Duh, and Jyh-Wei Lee! | Plasma electrolytic oxidation coatings on AZ31 magnesium alloys with Si3N4 nanoparticle additives | 2017年 |
| Chi-Yu Lu*, Wahyu Diyatmika*, Bih-Show Lou, Yu-Chu Lu*, Jenq-Gong Duh and Jyh-Wei Lee! | Influences of target poisoning on the mechanical properties of TiCrBN thin films grown by a superimposed high power impulse and medium frequency magnetron sputtering | 2017年 |
| Qi Bao*!, Joseph Lee*, and Jenq-Gong Duh | Building 3D Porous, Elastic and Hydrophilic Current Collectors: Prolonging the Cycling Life of Si Based Anode for Lithium Ion Batteries | 2017年 |
| Joseph Lee* and Jenq-Gong Duh! | Structural evolution of Zr-Cu-Ni-Al-N thin film metallic glass and its diffusion barrier performance in Cu-Si interconnect at elevated temperature | 2017年 |
| Wei-Yu Chen*, Rui-Wen Song* and Jenq-Gong Duh! | Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC Technologies | 2017年 |
| Yi-Chun Jin* and Jenq-Gong Duh! | Kinetic Study of High Voltage Spinel Cathode Material in a Wide Temperature Range for Lithium Ion Battery | 2017年 |
| Joseph Lee*, Ming-Li Liou and Jenq-Gong Duh! | The Development of a Zr-Cu-Al-Ag-N Thin Film Metallic Glass Coating in Pursuit of Improved Mechanical, Corrosion, and Antimicrobial Property for Bio-medical Application | 2017年 |
| Collin Fleshman*, Wei-Yu Chen*, Tzu-Ting Chou*, Jia-Hong Huang and Jenq-Gong Duh! | The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint | 2017年 |
| Bing-Hong Chen*, Chun-Chi Chang* and Jenq-Gong Duh! | Carbon Assisted Technique for Recycled Silicon/Silicon Carbide Composite in Lithium Ion Batteries | 2017年 |
| Wei-Ting Wong*, Bing-Hong Chen*, Irish Valerie B. Maggay*, Chang Liu*, Jenq-Gong Duh and Wei-Ren Liu! | Synthesis and Electrochemical Properties of Hierarchically Porous Zn(Co1-xMnx)2O4 Anode for Li-Ion Batteries via Cation Substitution Design | 2017年 |
| Chun-Chi Chang* and Jenq-Gong Duh! | Duplex Coating Technique to Improve the Adhesion and Tribological Properties of CrAlSiN Nanocomposite Coating | 2017年 |
| Wei-Yu Chen* and Jenq-Gong Duh! | Suppression of Cu3Sn layer and formation of multi-orientation IMCs during thermal aging in Cu/Sn-3.5Ag/Cu-15Zn transient liquid-phase bonding in novel 3D-IC Technologies | 2017年 |
| Yi-Chun Jin* and Jenq-Gong Duh! | Hierarchically-Structured Nanocrystalline Lithium Rich Layered Composites with Enhanced Rate Performances for Lithium Ion Battery | 2017年 |
| Pei-Hung Kuo*, Joseph Lee*, and Jenq-Gong Duh! | Ultra-thin metallic glass film of Zr–Cu–Ni–Al–N as diffusion barrier for Cu–Si interconnects under fully recrystallized temperature | 2018年 |
| Hao Yang*, Yan Wang*, and Jenq-Gong Duh! | Developing a Diamine-Assisted Polymerization Method To Synthesize Nano-LiMnPO4 with N-Doped Carbon from Polyamides for High-Performance Li-Ion Batteries | 2018年 |
| Cheng-Yu Wu*, Wei-En Chang*, Yu-Guang Sun*, Jyh-Ming Wu and Jenq-GongDuh! | Three-dimensional S-MoS2@α Fe2O3 nanoparticles composites as lithium-ion battery anodes for enhanced electrochemical performance | 2018年 |
| Guan-Ting Ye*, Po-Yu Chen and Jenq-Gong Duh! | Investigation of electrochemical properties of bio-inspired SiOx/PI multilayered thin film anode for lithium ion batteries | 2018年 |
| Heng Tao*, M.T. Tsai*, Hsien-Wei Chen*, J.C. Huang and Jenq-Gong Duh! | Improving high-temperature tribological characteristics on nanocomposite CrAlSiN coating by Mo doping | 2018年 |
| Wan-Ting Tsou*, Cheng-Yu Wu*, Hao Yang*, Jenq-Gong Duh! | Improving the electrochemical performance of Lithium–Sulfur batteries using an Nb-Doped TiO2 additive layer for the chemisorption of lithium polysulfides | 2018年 |
| Yan Wang*, Cheng-Yu Wu*, Hao Yang* and Jenq-Gong Duh! | Rational design of a synthetic strategy, carburizing approach and pore-forming pattern to unlock the cycle reversibility and rate capability of microagglomerated LiMn0.8Fe0.2PO4 cathode materials | 2018年 |
| Che-Ya Wu*, Hao Yang*, Cheng-Yu Wu*, Jenq-Gong Duh! | Flower-like structure of SnS with N-doped carbon via polymer additive for lithium-ion battery and sodium-ion battery | 2018年 |
| Yu-Chu Lu*, Hsien-Wei Chen*, Chun-Chi Chang, Cheng-Yu Wu*, Jenq-Gong Duh! | Tribological properties of nanocomposite Cr-Mo-Si-N coatings at elevated temperature through silicon content modification | 2018年 |
| Collin Fleshman*, Jenq-Gong Duh! | The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging | 2019年 |
| Rui-Wen Song*, Collin Jordon Fleshman*, Hao-Chen*, Su-Yueh Tsai, Jenq-Gong Duh! | Suppressing interfacial voids in Cu/In/Cu microbump with Sn and Cu addition | 2019年 |
| Hao Chen*, Tzu-Ting Chou*, Collin Jordan Fleshman*, Jenq-Gong Duh! | Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints | 2019年 |
| Tzu-Ting Chou*, Rui-Wen Song*, Hao Chen*, Jenq-Gong Duh! | Low thermal budget bonding for 3D-package by collapse-free hybrid solder | 2019年 |
| Rui-Wen Song*, Tzu-Ting Chou*, Collin Jordan Fleshman*, Hao Chen* and Jenq-Gong Duh! | The Architecture Design and Novel Material Selection for Improved Reliability of Solder Interconnections in Microelectronic Packaging | 2019年 |
| Chang Liu*, Bing-Hong Chen*, Wei-Ren Liu, Jenq-Gong Duh! | Synthesis and theoretical calculations of N-doped ZnCo2O4 anode for lithium-ion anode via gradient pressure-induced processes and theoretical calculations | 2019年 |
| Cheng-Yu Wu*, Qi Bao*, Yen Chung Lai, Xin Liu*, Yu-Chu Lu* Heng Tao* and Jenq-Gong Duh! | In-situ thermal annealing Pt/Ti interphase layers for epitaxial growth of improved Li(Ni0.5Mn0.3Co0.2)O2 solid thin-film cathodes | 2019年 |
| Ren-Chin Chen*, Li-Yin Hsiao*, Cheng-Yu Wu*, Jenq-Gong Duh! | Facile synthesizing silicon waste/carbon composites via rapid thermal process for lithium-ion battery anode | 2019年 |
| Hou Heng Lin*, Hao Yang*, Che Ya Wu*, Sheng Yu Hsu* and Jenq-Gong Duh! | Atmospheric Pressure Plasma Jet Irradiation of N Doped Carbon Decorated on Li4Ti5O12 Electrode as a High Rate Anode Material for Lithium Ion Batteries | 2019年 |
| Cheng-Yu Wu*, Jenq-Gong Duh! | Ionic network for aqueous-polymer binders to enhance the electrochemical performance of Li-Ion batteries | 2019年 |
| Tzu-Ting Chou*, Collin Jordon Fleshman*, Hao Chen* and Jenq-Gong Duh! | Improving thermal shock response of interfacial IMCs in Sn–Ag–Cu joints by using ultrathin-Ni/Pd/Au metallization in 3D-IC packages | 2019年 |
| Tzu-Ting Chou*, Rui-Wen Song*, Wei-Yu Chen*, and Jenq-Gong Duh! | Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy | 2019年 |