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Department of Materials Science and Engineering

2021 TSMC DNA internship program

2021 TSMC DNA internship program

Engineering fields:

Research and development, IC design, operational manufacturing, quality and reliability, information, etc.

Other professional fields:

Human resources, finance, legal affairs, business planning, materials and risk management, etc.

Application period:

From now to 2021/04/16

For more details, please refer to the following website:


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