Jump to the main content block

Department of Materials Science and Engineering

ImgDesc

Chien-Neng Liao

NTHU Distinguished Professor
Phone No. +886-3-5715131 #33843 (Lab:33860)
Office Delta Building R417, NTHU
E-mail cnliao@mx.nthu.edu.tw
Education Ph.D, Materials Science and Engineering, University of California, Los Angeles, USA
Personal Website http://www.mse.nthu.edu.tw/~cnliao/
Lab 33860
Discipline Kinetic Process of Materials, Introduction to Material Science and Engineering, Introduction to Quantum Physics, Thermoelectric materials, Nano/micro Electromechanical Systems (N/MEMS), Introduction to Crystal Structure and Diffraction Theories
Speciality
Thermoelectric Materials and Device; Optoelectronic and Electrochemistry Catalyst; Manufacture and Analysis for Electrode Materials; Synthesis and Analysis Copper Twin Crystal Nano-wire; Electromigration in Integrated Circuit Connecting Wire
 
Work Experience
Institution Title Date
Interdisciplinary Program of Engineering (IPE), National Tsing Hua University Vice Chair 2019-09 ~
Department of Materials Science and Engineering, National Tsing Hua University Professor 2010-08 ~
IEEE International Interconnect Technology Conference (IITC) Committee member 2009-09 ~ 2017-08
Department of Materials Science and Engineering, National Tsing Hua University Vice Chairman 2009-09 ~ 2012-08
Department of Materials Science and Engineering, National Tsing Hua University Associate Professor 2006-08 ~ 2010-07
Department of Materials Science and Engineering, National Tsing Hua University Assistant Professor 2001-08 ~ 2006-07
Intel Corporation Senior Research Engineer 1999-08 ~ 2001-07
Inside School HonorOverview
得獎年度 獎項名稱 頒獎單位
2017 Outstanding Teaching Award National Tsing Hua University
2014 Outstanding Teaching Award National Tsing Hua University
2014 Outstanding Teaching Award College of Engineering, National Tsing Hua University
2006 Outstanding Teaching Award College of Engineering, National Tsing Hua University
2006 New Faculty Research Award College of Engineering, National Tsing Hua University
Outside School HonorOverview
得獎年度 獎項名稱 頒獎單位
2009 Ta-You Wu Memorial Research Award 2009 National Science Council
2009 Award for Junior Research Investigators 2009 Academia Sinica
2009 Nano Science & Technology of Y. Z. Hsu Scientific Paper Award Far Eastern Y. Z. Hsu Science and Technology Memorial Foundation
Research ProjectOverview
Year Project Name Participator Job Period Cooperative Organization
2019 Development of thick-film printing technology for low-power thermoelectric generators Chien-Neng Liao PI 2019-08 ~ 2022-07 Ministry of Science and Technology
2019 微型散熱裝置內部毛細結構製作與特性研究 Chien-Neng Liao PI 2019-05 ~ 2020-04 Advanced Semiconductor Engineering, Inc.
2018 Investigation of nanotwinned Cu/oxide core-shell nanoarrays in bio-sensing and hydrogen energy applications Chien-Neng Liao PI 2018-08 ~ 2019-07 Ministry of Science and Technology
2018 Electromigration-induced nanoprecipitation in thermoelectric materials: Processing, Characterization and Modeling Chien-Neng Liao PI 2018-04 ~ 2020-03 Ministry of Science and Technology
2017 印刷熱電源元件堆疊與電流燒結機制探討 Chien-Neng Liao PI 2017-04 ~ 2017-11 Industrial Technology Research Institute
2017 A study of nanotwinned Cu nanoarray structures: Oxide formation kinetics and photoelectrochemical characterization Chien-Neng Liao PI 2016-08 ~ 2018-07 Ministry of Science and Technology
2016 105年度大專學生研究計畫-碲化鉍系熱電厚膜製程及特性分析 Chien-Neng Liao PI 2016-07 ~ 2017-02 Ministry of Science and Technology
2016 A study of nanotwinned Cu nanoarray structures: Oxide formation kinetics and photoelectrochemical characterization1/2 Chien-Neng Liao PI 2016-08 ~ 2018-07 Ministry of Science and Technology
2016 學界分包-印刷熱電材料燒結機制及特性分析 Chien-Neng Liao PI 2016-04 ~ 2015-11 Industrial Technology Research Institute
2015 Fabrication and characterization of nanotwinned Cu-based alloy nanowires(3/3) Chien-Neng Liao PI 2015-08 ~ 2016-07 Ministry of Science and Technology
2015 Electromigration in V-VI compound semiconductors: transport mechanism and applications in thermoelectrics(1/3) Chien-Neng Liao PI 2015-08 ~ 2016-07 Ministry of Science and Technology
2015 委託Bi2Te3印刷熱電材料電流輔助退火製程 Chien-Neng Liao PI 2015-07 ~ 2015-12 Industrial Technology Research Institute
2014 Fabrication and characterization of nanotwinned Cu-based alloy nanowires(2/3) Chien-Neng Liao PI 2014-08 ~ 2015-07 Ministry of Science and Technology
2014 具奈米雙晶結構銅奈米線之可靠度研究 Chien-Neng Liao PI 2014-04 ~ 2015-03 TSMC
2014 Bi2Te3系統熱電材料電流輔助熱退火燒結 Chien-Neng Liao PI 2014-06 ~ 2014-12 Industrial Technology Research Institute
2014 高熱電功率熱電薄膜材料開發研究 Chien-Neng Liao PI 2014-08 ~ 2015-07 Ministry of Science and Technology
2014 103年度大專學生研究計畫 Chien-Neng Liao PI 2014-07 ~ 2015-02 Ministry of Science and Technology
2013 Transport mechanism of doping-induced homojuncion structured thermoelectric materials(2/2) Chien-Neng Liao PI 2013-08 ~ 2014-07 National Science Council
2013 碲化鉍系熱電材料改質開發研究 Chien-Neng Liao PI 2013-02 ~ 2014-11 China Steel Corporation
2013 Fabrication and characterization of nanotwinned Cu-based alloy nanowires(1/3) Chien-Neng Liao PI 2013-08 ~ 2014-07 National Science Council
2013 熱電模組結合界面原子擴散機制探討 Chien-Neng Liao PI 2013-04 ~ 2013-11 Industrial Technology Research Institute
2013 熱電轉換材料應用與評估 Chien-Neng Liao PI 2013-03 ~ 2013-11 Taiwan Textile Research Institute
2012 Transport mechanism of doping-induced homojuncion structured thermoelectric materials Chien-Neng Liao PI 2012-08 ~ 2013-07 National Science Council
2012 Structure stability of nanotwinned Cu wires under electrical and thermal stressing(3/3) Chien-Neng Liao PI 2012-08 ~ 2013-07 National Science Council
2012 電流退火操控熱電材料微結構與析出相之研究 Chien-Neng Liao PI 2012-04 ~ 2012-11 Industrial Technology Research Institute
2012 碲化鉍系熱電材料改質開發研究 Chien-Neng Liao PI 2012-08 ~ 2013-07 China Steel Corporation
2009 高頻電力與信號傳輸元件之薄膜化與材料技術三年計畫(第2年) Chien-Neng Liao PI 2009-07 ~ 2010-06 經濟部學界科專
2009 Fabrication and characterization of high-power thin film thermoelectric coolers(3/3) Chien-Neng Liao PI 2009-08 ~ 2010-07 National Science Council
2009 Low-temperature waste heat harvesting system by thermoelectric generation technology Chien-Neng Liao PI 2009-11 ~ 2010-12 National Science Council
2009 電池管理模組散熱用奈米薄膜型熱電元件開發 Chien-Neng Liao PI 2009-02 ~ 2009-11 Industrial Technology Research Institute
2009 電流效應對鉍-硒-碲奈米晶薄膜熱電性質影響之研究 Chien-Neng Liao PI 2009-04 ~ 2009-11 Industrial Technology Research Institute
2009 奈米電子元件雙晶結構銅導線之電遷移動力機制研究 Chien-Neng Liao PI 2009-03 ~ 2009-12 Ministry of Education
2008 高頻電力與信號傳輸元件之薄膜化與材料技術三年計畫(第1年) Chien-Neng Liao PI 2008-07 ~ 2009-06 經濟部學界科專
2008 電流效應對碲化鉍熱電薄膜微結構與性質影響 Chien-Neng Liao PI 2008-05 ~ 2008-11 Industrial Technology Research Institute
2008 Fabrication and characterization of high-power thin film thermoelectric coolers(2/3) Chien-Neng Liao PI 2008-08 ~ 2009-07 National Science Council
2008 Development of nanoscale thin film thermoelectric devices Chien-Neng Liao PI 2008-01 ~ 2008-12 National Science Council
2007 奈米晶尺寸效應對碲化鉍系列材料熱電性質影響之研究 Chien-Neng Liao PI 2007-05 ~ 2007-11 Industrial Technology Research Institute
2007 熱電薄膜沉積製程與特性量測研究 Chien-Neng Liao PI 2007-04 ~ 2007-11 Industrial Technology Research Institute
2007 Fabrication and characterization of high-power thin film thermoelectric coolers(1/3) Chien-Neng Liao PI 2007-08 ~ 2008-07 National Science Council
2006 高頻通訊元件及高材料技術計畫第四年 Chien-Neng Liao PI 2006-06 ~ 2007-05 Ministry of Economic Affairs
2006 薄膜材料熱傳導量測研究與系統設計 Chien-Neng Liao PI 2006-04 ~ 2006-11 Industrial Technology Research Institute
2006 提升產業技術及培育研究計畫--熱電材料性質量測技術開發研究 Chien-Neng Liao PI 2006-05 ~ 2007-04 致惠科技
2006 Effects of interfacial reactions on sold joint characteristics and performance of thermoelectric modules Chien-Neng Liao PI 2006-08 ~ 2007-07 National Science Council
2006 Development of thermoelectric materials characterization techniques Chien-Neng Liao PI 2006-05 ~ 2007-04 National Science Council
2005 A study of reaction kinetics and thermoelectric poperties of Bi/Te composite thin films Chien-Neng Liao PI 2005-08 ~ 2006-07 National Science Council
2005 熱電致冷器之製作相關技術與相關機台建立服務 Chien-Neng Liao PI 2005-04 ~ 2006-03 致惠科技
2004 A study of thermoelectric properties of multi-element high entropy alloy Chien-Neng Liao PI 2004-08 ~ 2005-07 National Science Council
2004 Effect of intermetallic compound formation on electrical and thermal characteristics of solder joints Chien-Neng Liao PI 2004-08 ~ 2005-07 National Science Council
2004 無塵室高溫製程設備操作模式探討 Chien-Neng Liao PI 2004-03 ~ 2004-11 Industrial Technology Research Institute
Journal Articles
Year Author Title
Accepted P.-C. Wei, C. N. Liao, H.-J. Wu, D. Yang, J. He, G. V. Biesold-McGee, S. Liang, W.-T. Yen, X. Tang, J.-W. Yeh, Z. Lin, and J. H. He “Thermodynamic routes to ultra-low thermal conductivity and high thermoelectric performance”, Adv. Mater.
2020 C.-Y. Lan, C.-Y. Hsu, Y.-C. Lee, C. N. Liao* “Grain growth behavior and enhanced thermoelectric properties ofPbTe consolidated by high-density pulse current”, J. Alloys Comp., 815, 1526582.
2019 H.-H. Fan, W.-L. Weng, C.-Y. Lee, C. N. Liao* “Electrochemical Cycling-Induced Spiky CuxO/Cu Nanowire Array for Glucose Sensing”, ACS Omega, 4, 12222 – 12229.
2019 C.-L. Huang, W.-L. Weng, Y.-S. Huang C. N. Liao* ”Enhanced photolysis stability of Cu2O grown on Cu nanowires with nanoscale twin boundaries”, Nanoscale, 11, 13709 - 13713. DOI: 10.1039/c9nr01406c. (Outside Back Cover).
2018 W.-L. Weng, C.-Y. Hsu, J.-S. Lee, H.-H. Fan, C. N. Liao* “Twin-mediated epitaxial growth of highly lattice-mismatched Cu/Ag core–shell nanowires”, Nanoscale, 10, 9862-9866.
2018 Chun-Lung Huang, Wei-Lun Weng, Chien-Neng Liao*, K. N. Tu Nature Communications:Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface
2018 J.-C. Hsiao, Y.-H. Chen, C. N. Liao* “Anisotropic thermal conductivity of sputtered Bi0.5Sb1.5Te3 films after current-assisted thermal treatment”, Thin Solid Films, 645, 93-96.
2018 C.-T. Li, Y.-H. Chen, C. N. Liao* “Electrically motivated atomic migration and defect formation in Bi0.5Sb1.5Te3 compounds”, Mater. Chem. Phys., 204, 373-377. (SCI)
2018 C.-L. Huang, W.-L. Weng, C. N. Liao*, K. N. Tu “Suppression of interdiffusion- induced voiding in oxidation of copper nanowires with twin-modified surface”, Nat. Commun. 9, 340.
2017 Y.-H. Chen and C. N. Liao* “Transport properties of electrically sintered bismuth antimony telluride with antimony nanoprecipitation”, Appl. Phys. Lett., 111, 143901.
2017 Y.-H. Chen and C. N. Liao* “Scattering characteristics of grain boundaries in electrically sintered Bi0.4Sb1.6Te3 compounds”, Mater. Lett., 197, 21-23.
2017 J.-S. Lee, W.-L. Weng, C. N. Liao* “Characterization and modeling of twinning superlattice structure in copper nanowires”, Mater. Lett., 194, 23-25.
2017 T. T. Shen, C. N. Liao* “Enhancement of fatigue resistance of Bi-Sb-Te films on flexible substrates by current-assisted thermal annealing”, Mater. Lett., 186, 314-317.
2016 H.-H. Huang, M.-P. Lu and C. N. Liao* “Transverse thermoelectric effect of asymmetrically doped Bi-Sb-Te compounds”, J. Appl. Phys., 119, 205101.
2016 Y.-T. Huang, C.-W. Huang, J.-Y. Chen, Y.-H. Ting, S.-L. Cheng, C.-N. Liao and W.-W. Wu “Mass transport phenomena in copper nanowires at high current density”, Nano Research, 9, 1071.
2016 H.-P. Chen, C.-W. Huang, C.-W. Wang, W.-W. Wu, C.-N. Liao, L.-J. Chen and K.-N. Tu, “Optimization of the nanotwin-induced zigzag surface of copper by electromigration”, Nanoscale, 8, 2584.
2015 M.-P. Lu, C. N. Liao*, J.-Y. Huang, H.-C. Hsu “Thermoelectric Properties of Ag-Doped Bi2(Se,Te)3 Compounds: Dual Electronic Nature of Ag-Related Lattice Defects”, Inorg. Chem., 54, 7438.
2015 C.-L. Huang and C. N. Liao* “Chemical reactivity of twin-modified copper nanowire surfaces”, Appl. Phys. Lett., 107, 021601.
2015 C.-J. Yang, C.-L. Huang and C. N. Liao* “Enhancing chemical stability of electroplated Cu films by engineering electrolyte chemistry and twinning structure”, J. Electron. Mat. 44, 2529.
2014 P. H. Le*, C. N. Liao, C. W. Luo, J. Leu! Thermoelectric properties of nanostructured bismuth-telluride thin films grown using pulsed laser deposition, J. Alloys Comp. 615, 546–552,
2014 Y. L. Liu* and C. N. Liao! Experimental and theoretical assessments of thermal boundary resistance between Bi0.4Sb1.6Te3 thin films and metals, Appl. Phys. Lett., 105, 013903,
2014 H. W. Tsai*, T. H. Wang*, T. C. Chan*, P. J. Chen*, C. C. Chung*, A. Yaghoubi*, C. N. Liao, E. W.-G. Diau, Y. L. Chueh! Fabrication of Large Scale Single Crystal Bismuth Telluride (Bi2Te3) Nanosheet Arrays by Single Step Electrolysis Process, Nanoscale, 6, 7780,
2014 T. C. Chan*, Y. M. Lin*, H. W. Tsai*, C. C. Lin*, Z. M. Wang, C. N. Liao!, Y. L. Chueh! Growth of large-scale nanotwinned Cu nanowire arrays from anodic aluminum oxide membrane by electrochemical deposition process: Controllable nanotwin density and growth orientation with enhanced electrical endurance performance, Nanoscale, 6, 7332,
2014 P.-J. Chen* and C. N. Liao! Thermoelectric transport properties of Bi-Te based thin films on strained polyimide substrates, Appl. Phys. Lett., 105, 133903,
2014 P.-J. Chen and C. N. Liao “Thermoelectric transport properties of BiTe based thin films on strained polyimide substrates”, Appl. Phys. Lett., 105, 133903.
2014 T.-C. Chan*, Y.-Z. Chen*, Y.-L. Chueh!, C. N. Liao! Large-scale nanotwins in copper films/Cu nanowires via stress engineering by high energy ion beam bombardment process: growth and characterization, J. Mater. Chem. C, 2, 9777-10038,
2013 C. N. Liao!, Y. C. Lu* and D. Xu Modulation of crystallographic texture and twinning structure of Cu nanowires by electrodeposition, J. Electrochem. Soc.,
2013 C. N. Liao!, C.-Y. Lin*, C.-L. Huang* and Y.-S. Lu* Morphology, Texture and Twinning Structure of Cu Films Prepared by Low-temperature Electroplating, J. Electrochem. Soc.,
2013 M.-P. Lu* and C. N. Liao! Mechanical and thermal processing effects on crystal defects and thermoelectric transport properties of Bi2(Se,Te)3 compounds, J. Alloys Compd.,
2013 H.-H. Huang*, M.-P. Lu*, C.-H. Chiu*, L.-C. Su*, C. N. Liao!, J.-Y. Huang, H.-L. Hsieh Enhanced Seebeck coefficient of bismuth telluride compounds with graded doping profiles, Appl. Phys. Lett.,
2013 P. H. Le*, C. N. Liao, C. W. Luo, J.-Y. Lin, J. Leu! Thermoelectric properties of bismuth-selenide films with controlled morphology and texture grown using pulsed laser deposition, Appl. Surf. Sci,
2012 T. Y. Lin, C. N. Liao, A. T. Wu “Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials”, J. Electron. Mat. 41, 153.
2011 S. S. Lin and C. N. Liao “Effect of ball milling and post treatment on crystal defects and transport properties of Bi2(Se,Te)3 compounds”, J. Appl. Phys., 110, 093707.
2011 T. C. Chan, Y. L. Chueh and C. N. Liao “Manipulating the crystallographic texture of nanotwinned Cu films by electrodeposition”, Cryst. Growth Des., 11, 4970.
2011 T. C. Chan, K. C. Chen and C. N. Liao “Surface roughness reduction of nanocrystalline Cu thin films by electrical stressing treatment”, Appl. Phys. Lett., 98, 181902.
2011 C. N. Liao, X. W. Su, K. M. Liou and H. S. Chu “Electrical and thermal transport properties of electrically stressed Bi-Sb-Te nanocrystalline thin films”, Thin Solid Films, 519, 4394.
2011 C. H. Lee, W. T. Chen and C. N. Liao “Effect of antimony on vigorous interfacial reaction of Sn-Sb/Te couples”, J. Alloys Compd., 509, 5142.
2010 C. N. Liao, W. T. Chen and C. H. Lee “Polarity effect on interfacial reactions at soldered junctions of electrically stressed thermoelectric modules”, Appl. Phys. Lett. 97, 241906.
2010 C. N. Liao, H. D. Shih and P. W. Su “Electrocrystallization of Mutually Crossed Bismuth Telluride Nanoplatelets”, J. Electrochem. Soc. 157, D605.
2010 K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu “Stability of nanoscale twins in copper under electric current stressing”, J. Appl. Phys. 108, 066103.
2010 K. M. Liou and C. N. Liao “Electric current enhanced defect elimination in thermally annealed BiSbTe and BiSeTe thermoelectric thin films”, J. Appl. Phys., 108, 053711.
2010 C. N. Liao, C. Y. Chang and H. S. Chu “Thermoelectric properties of electrically stressed Sb/Bi–Sb–Te multilayered films”, J. Appl. Phys., 107, 066103.
2010 C. N. Liao and Y. C. Huang “Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium”, J. Mat. Res., 25, 391.
2010 C. N. Liao, L. C. Wu and J. S. Lee “Thermoelectric properties of Bi-Sb-Te materials prepared by electric current stressing”, J. Alloys Compd., 490, 468.
2009 C. N. Liao and L. C. Wu “Enhancement of carrier transport properties of BixSb2-xTe3 compounds by electrical sintering process”, Appl. Phys. Lett., 95, 052112.
2008 C. N. Liao, Y. C. Wang and H. S. Chu “Thermal transport properties of nanocrystalline Bi–Sb–Te thin films prepared by sputter deposition”, J. Appl. Phys., 104, 104302.
2008 C. N. Liao and C. H. Lee “Suppression of vigorous liquid Sn/Te reactions by Sn-Cu solder alloys”, J. Mat. Res., 23, 3303.
2008 S. D. Li, J. G. Duh and C. N. Liao “High-frequency ferromagnetic inductors covered by as-deposited FeCoAlO films with stress-induced uniaxial anisotropy”, Thin Solid Films, 516, 7748.
2008 K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu “Observation of Atomic Diffusion at Twin-modified Grain Boundaries in Copper”, Science, 321, 1066.
2008 C. N. Liao, K. M. Liou and H. S. Chu “Enhancement of thermoelectric properties of sputtered Bi-Sb-Te thin films by electric current stressing”, Appl. Phys. Lett., 93, 042103.
2007 C. M. Tai and C. N. Liao ”A Physical Model of Solenoid Inductors on Silicon Substrates”, IEEE Trans. Microwave Theory Tech., 55(12), 2579.
2007 C. N. Liao, C. H. Lee and W. J. Chen “Effect of interfacial compound formation on contact resistivity of soldered junctions between bismuth telluride based thermoelements and copper”, Electrochem. Solid-State Lett., 10(9), P23.
2007 C. M. Chen, C. C. Huang, C. N. Liao, and K. M. Liou “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, J. Electron. Mat. 36, 760.
2007 K. C. Chen, C. N. Liao, W. W. Wu and L. J. Chen “Direct observation of electromigration-induced surface atomic steps in Cu lines by in-situ transmission electron microscopy”, Appl. Phys. Lett., 90, 203101.
2007 C. N. Liao and T. H. She Preparation of bismuth telluride thin films through interfacial reaction, Thin Solid Films, 515, 8059.
2007 C. M. Tai and C. N. Liao Multi-level suspended thin film inductors on silicon wafers, IEEE Trans. Electron. Dev., 54 (6), 1510.
2007 C. N. Liao, T. H. She, P. J. Liao and H. S. Chu Oscillatory transport properties of thermally annealed Bi/Te multilayer thin films, J. Electrochem. Soc. 154 (4), H304.
2006 C. N. Liao, H. N. Wu, P. C. Chen and J. W. Yeh Effect of antimony doping on thermoelectric properties of Zr0.5Ti0.5NiSn multi-element alloys, ANNALES DE CHIMIE - science des matériaux, 31(6), 711.
2006 C. N. Liao and C. T. Wei An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples, Thin Solid Films, 515, 2781.
2005 C. N. Liao, C. P. Chung and W. T. Chen Electromigration induced Pb Segregation in Eutectic Sn-Pb Molten Solder, J. Mat. Res., 20, 3425.
2005 C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen In situ transmission electron microscope observations of electromigration in copper lines at room temperature, Appl. Phys. Lett., 87, 141903.
2005 C. N. Liao and K. C. Chen Effect of interfacial resistance and contact size on current crowding at Ni/poly-Si junctions, Semi. Sci. Tech., 20, 659.
2005 C. N. Liao and S. W. Kuo Thermoelectric characterization of sputter-deposited Bi/Te bilayer thin films, J. Vac. Sci. Tech. A, 23, 559 (SCI)
2005 C. N. Liao and K. M. Liou Electrical properties of Cu/Ta interfaces under electrical current stressing, J. Vac. Sci. Tech. A, 23, 359.
2004 C. N. Liao and C. T. Wei Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment, J. Electron. Mat., 33, 1137.
2003 C. N. Liao and K. C. Chen Current crowding effect on thermal characteristics of Ni/doped-Si contacts”, IEEE Electron Device Letters, 24, 637.
2002 C. N. Liao and K. N. Tu Direct measurement of contact temperature using Seebeck potential, J. Appl. Phys., 92, 635.